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STIEC45-30ACS

STMicroelectronics

STIEC45-30ACS by STMicroelectronics

STIEC45-30ACS by STMicroelectronics is a single transient suppression device with bidirectional polarity. It operates b/w -55°C to 150°C, with breakdown voltage ranging from 33.3V to 36.8V. Ideal for applications requiring protection against electrostatic discharge according to IEC standards.

Median Price

$0.411

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.411

100+ parts

-

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50

$0.411

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Chip Stock

USA . 9,036 parts In-Stock

1+ parts

-

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9,036

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Digiode

USA . 2,736 parts In-Stock

1+ parts

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2,736

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Vyrian

USA . 2,552 parts In-Stock

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2,552

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Anansix

USA . 2,507 parts In-Stock

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2,507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,792 parts In-Stock

1+ parts

$0.129

100+ parts

-

1k+ parts

$0.116

10k+ parts

-

1,792

$0.129

-

$0.116

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Corohmni

South Africa . 513 parts In-Stock

1+ parts

$0.180

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513

$0.180

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Aztec Data Supply Inc.

USA . 2,772 parts In-Stock

1+ parts

$0.190

100+ parts

-

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2,772

$0.190

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MKK Technologies

India . 1,417 parts In-Stock

1+ parts

$0.242

100+ parts

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1,417

$0.242

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DigiPath Technology Company

USA . 1,417 parts In-Stock

1+ parts

$0.242

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1,417

$0.242

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Argo Parts USA

USA . 4,430 parts In-Stock

1+ parts

$0.411

100+ parts

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$0.399

4,430

$0.411

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-

$0.399

Continental Prestige Electronics

USA . 2,349 parts In-Stock

1+ parts

$0.411

100+ parts

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1k+ parts

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10k+ parts

$0.403

2,349

$0.411

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-

$0.403

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.411

100+ parts

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1,000

$0.411

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-

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Ampacity Inc.

Singapore . 785 parts In-Stock

1+ parts

$2.010

100+ parts

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785

$2.010

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$5.009

100+ parts

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820

$5.009

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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90,000

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Lixinc

USA . 9,171 parts In-Stock

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9,171

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A-Z Elektronik GmbH

Germany . 6,077 parts In-Stock

1+ parts

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6,077

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Corphita

USA . 4,803 parts In-Stock

1+ parts

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4,803

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Parana Technologies

USA . 1,123 parts In-Stock

1+ parts

-

100+ parts

$0.154

1k+ parts

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10k+ parts

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1,123

-

$0.154

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-

Overview

Looking for reliable transient suppression devices? Look no further than the STIEC45-30ACS by STMicroelectronics. With a reputation for quality and innovation, STMicroelectronics delivers top-of-the-line products that meet the highest standards in the industry. The STIEC45-30ACS is perfect for a wide range of applications, offering customers peace of mind with its superior performance and durability. Trust STMicroelectronics to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides excellent durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuits, saving space and reducing assembly time.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transient suppression device can withstand elevated temperatures without compromising its performance.

Minimum Breakdown Voltage: 33.3 V

The minimum breakdown voltage ensures effective protection against voltage spikes, safeguarding connected components from damage.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of Trans Voltage Suppressor diodes ensures efficient and reliable transient voltage suppression, enhancing the overall performance of the device.

Technical Specifications

Transient Suppression Devices STIEC45-30ACS attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

36.8 V

Minimum Breakdown Voltage:

33.3 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AB

JESD-30 Code:

R-PDSO-C2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

30 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STIEC45-30ACS Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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