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STIEC45-60AS

STMicroelectronics

STIEC45-60AS by STMicroelectronics

STIEC45-60AS by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for robust protection in electronic circuits. It operates b/w -55 °C to 150 °C, with a breakdown voltage range of 66.6V to 73.6V. Ideal for applications requiring compliance with IEC standards, it features a compact surface mount design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,691 parts In-Stock

1+ parts

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3,691

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Digiode

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,250

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Anansix

USA . 195 parts In-Stock

1+ parts

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195

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 230 parts In-Stock

1+ parts

$0.123

100+ parts

-

1k+ parts

$0.111

10k+ parts

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230

$0.123

-

$0.111

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MKK Technologies

India . 136 parts In-Stock

1+ parts

$0.232

100+ parts

-

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136

$0.232

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DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

$0.232

100+ parts

-

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136

$0.232

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Corphita

USA . 3,229 parts In-Stock

1+ parts

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3,229

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Parana Technologies

USA . 1,552 parts In-Stock

1+ parts

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100+ parts

$0.147

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1,552

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$0.147

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Overview

Elevate your designs with the STIEC45-60AS from STMicroelectronics, a leader in innovation and quality. This premium transient suppression device ensures superior protection against voltage spikes, enhancing the longevity and reliability of your applications. With robust temperature tolerance and a compact design, it seamlessly integrates into various electronic circuits—from consumer electronics to industrial systems—delivering unmatched value and performance that you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and reliability, making the device suitable for a variety of applications.

Config: SINGLE

Single configuration simplifies integration into electronic circuits, reducing design complexity.

Surface Mount: YES

Surface mount capability allows for automated assembly and saves space on printed circuit boards (PCBs).

Package Shape: RECTANGULAR

Rectangular package shape optimizes layout on the PCB, enhancing space efficiency.

No. of Terminals: 2

Two terminals facilitate straightforward connectivity in a compact design.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs and fits well in space-constrained applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliability and performance in demanding environments.

Minimum Operating Temperature: -55 °C

Wide temperature range (-55 °C to 150 °C) makes this device suitable for extreme conditions in various applications.

Terminal Position: DUAL

Dual terminal positioning allows for versatile integration and layout options in circuit design.

Minimum Breakdown Voltage: 66.6 V

Low minimum breakdown voltage provides effective protection against transient voltage spikes.

Maximum Breakdown Voltage: 73.6 V

Controlled maximum breakdown voltage ensures reliable suppression of voltage transients, protecting sensitive components.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliant with established international standards, ensuring its effectiveness and safety in transient suppression.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Designed to protect against voltage transients, making it ideal for sensitive electronic devices.

Technology: AVALANCHE

Avalanche technology provides fast response and reliable suppression of transient voltages.

Terminal Form: C BEND

C bend terminal form enhances mechanical stability and simplifies soldering during assembly.

Maximum Repetitive Peak Reverse Voltage: 60 V

High repetitive peak reverse voltage rating ensures the device can withstand frequent voltage spikes.

Polarity: UNIDIRECTIONAL

Unidirectional design simplifies implementation in applications where reverse current protection is needed.

Diode Element Material: SILICON

Silicon material offers excellent electrical characteristics and thermal stability for reliable performance.

Technical Specifications

Transient Suppression Devices STIEC45-60AS attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

73.6 V

Minimum Breakdown Voltage:

66.6 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AB

JESD-30 Code:

R-PDSO-C2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

60 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

STIEC45-60AS Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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