Loading...

STI47N60DM6AG

STMicroelectronics

STI47N60DM6AG by STMicroelectronics

STI47N60DM6AG from STMicroelectronics is a robust N-channel FET designed for switching applications, featuring a 600V breakdown voltage and 36A max drain current. It offers high power dissipation of 250W and operates efficiently in -55 °C to 150 °C. Ideal for demanding power management tasks.

Median Price

$7.145

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 61 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$5.430

-

-

-

Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$6.040

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$6.040

-

-

-

DigiKey

USA . 795 parts In-Stock

1+ parts

$7.070

100+ parts

$3.478

1k+ parts

$2.911

10k+ parts

-

795

$7.070

$3.478

$2.911

-

Mouser Electronics

USA . 21 parts In-Stock

1+ parts

$7.220

100+ parts

$3.480

1k+ parts

$3.330

10k+ parts

-

21

$7.220

$3.480

$3.330

-

Newark

USA . 61 parts In-Stock

1+ parts

$8.450

100+ parts

$4.860

1k+ parts

$4.440

10k+ parts

-

61

$8.450

$4.860

$4.440

-

Element14

Singapore . 61 parts In-Stock

1+ parts

$9.750

100+ parts

$5.840

1k+ parts

$4.430

10k+ parts

-

61

$9.750

$5.840

$4.430

-

Avnet

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,393 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

-

10k+ parts

-

3,393

$3.258

-

-

-

Vyrian

USA . 2,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,713

-

-

-

-

Anansix

USA . 2,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,282

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$1.397

100+ parts

-

1k+ parts

$1.257

10k+ parts

-

564

$1.397

-

$1.257

-

MKK Technologies

India . 2,024 parts In-Stock

1+ parts

$2.626

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$2.626

-

-

-

DigiPath Technology Company

USA . 2,024 parts In-Stock

1+ parts

$2.626

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$2.626

-

-

-

Corphita

USA . 2,705 parts In-Stock

1+ parts

$3.087

100+ parts

-

1k+ parts

-

10k+ parts

-

2,705

$3.087

-

-

-

Continental Prestige Electronics

USA . 69 parts In-Stock

1+ parts

$4.630

100+ parts

$3.460

1k+ parts

$2.760

10k+ parts

-

69

$4.630

$3.460

$2.760

-

Microchip USA

USA . 7,397 parts In-Stock

1+ parts

$19.376

100+ parts

-

1k+ parts

-

10k+ parts

-

7,397

$19.376

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Alle Elektronik GmbH

Germany . 821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

821

-

-

-

-

Parana Technologies

USA . 728 parts In-Stock

1+ parts

-

100+ parts

$1.670

1k+ parts

-

10k+ parts

-

728

-

$1.670

-

-

Overview

Elevate your power management solutions with the STI47N60DM6AG from STMicroelectronics, a trusted leader in semiconductor technology. This robust N-channel FET is engineered for exceptional performance in demanding applications, ensuring reliability and efficiency. With built-in diode protection and impressive thermal handling, it simplifies design while reducing costs. Experience the perfect blend of quality and innovation that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers good durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and have lower on-resistance compared to P-channel alternatives, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in handling inductive loads, making this FET suitable for switching applications in motor drivers and other circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high-speed operation, enhancing the overall efficiency of electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage makes this FET suitable for high-voltage applications, providing reliability in demanding circumstances.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, optimizing layouts for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are easier to solder, making this FET suitable for prototyping and mass production.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption in the off state, helping to reduce energy costs in various applications.

Maximum Pulsed Drain Current (IDM): 137 A

A high pulsed drain current capability allows this FET to handle transient loads effectively, ideal for applications requiring brief high-power bursts.

Avalanche Energy Rating (EAS): 700 mJ

The ability to withstand significant avalanche energy enhances reliability in high-stress environments, making this device suitable for robust applications.

Maximum Drain Current (Abs) (ID): 36 A

With a maximum drain current rating of 36 A, this FET is capable of supporting substantial loads for various high-power applications.

No. of Terminals: 3

A 3-terminal configuration simplifies integration into circuits, allowing for easier design and layout.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability ensures effective thermal management, enabling the FET to operate safely in demanding conditions.

Package Style (Meter): IN-LINE

The in-line package style promotes easier alignment on PCBs and supports automated assembly processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high-speed operation and excellent performance, making this FET suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

A high operating temperature range allows for use in harsh environments, enhancing versatility across various applications.

Transistor Element Material: SILICON

Silicon technology provides good performance characteristics and reliability, making this FET a trusted choice in the industry.

Minimum Operating Temperature: -55 °C

The capability to function at very low temperatures makes this FET ideal for aerospace and automotive applications.

Maximum Drain-Source On Resistance: 0.08 ohm

Low on-resistance leads to reduced power losses during operation, improving energy efficiency in applications.

Terminal Position: SINGLE

A single terminal position facilitates straightforward design integration and makes it easier for circuit layouts.

Case Connection: DRAIN

DRAIN connection design allows for efficient load management in power circuits, ensuring improved performance.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures the FET meets stringent automotive quality standards, enhancing reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STI47N60DM6AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

137 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI47N60DM6AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6