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STI42N65M5

STMicroelectronics

STI42N65M5 by STMicroelectronics

STI42N65M5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 33A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 2,779 parts In-Stock

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Digiode

USA . 2,403 parts In-Stock

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Anansix

USA . 1,828 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 62 parts In-Stock

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Bristol Electronics

USA . 62 parts In-Stock

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Dan-Mar Components

USA . 62 parts In-Stock

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IDEA Electronic Components Group

UK . 768 parts In-Stock

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$1.078

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$0.970

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768

$1.078

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$0.970

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MKK Technologies

India . 631 parts In-Stock

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$2.028

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631

$2.028

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DigiPath Technology Company

USA . 631 parts In-Stock

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$2.028

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631

$2.028

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$2.281

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$2.076

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$1.870

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870

$2.281

$2.076

$1.870

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AZTECH Wire

Italy . 575 parts In-Stock

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$13.560

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575

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,368 parts In-Stock

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Corphita

USA . 4,787 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,832 parts In-Stock

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Parana Technologies

USA . 2,180 parts In-Stock

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$1.289

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Perfect Parts

USA . 637 parts In-Stock

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Overview

Unlock the power of efficiency with the STI42N65M5 from STMicroelectronics, a leader in high-quality semiconductor solutions. This N-channel power FET is designed for robust switching applications, offering exceptional reliability and superior performance in demanding environments. With its impressive breakdown voltage and built-in diode, it ensures seamless operation while minimizing energy loss. Elevate your projects with a trusted component that delivers outstanding value and enhances your system's performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and ensures cost-effectiveness for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and better performance in switching applications compared to P-channel devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves reliability and simplifies circuit design by integrating necessary components.

Transistor Application: SWITCHING

Designed specifically for switching, this FET offers fast response times and low power loss, making it ideal for high-speed applications.

Minimum DS Breakdown Voltage: 650 V

A breakdown voltage of 650 V ensures robust performance in high-voltage applications, preventing device failure.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space-saving designs, making it versatile for various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mounting and excellent mechanical stability, ideal for demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for minimal gate drive requirements, improving energy efficiency.

Maximum Pulsed Drain Current (IDM): 132 A

A high pulsed drain current capability makes this FET suitable for applications requiring short bursts of high current.

Avalanche Energy Rating (EAS): 950 mJ

This high avalanche energy rating contributes to the device's robustness against transient conditions, ensuring reliability.

Maximum Drain Current (Abs) (ID): 33 A

A maximum drain current of 33 A allows this device to handle substantial loads, suitable for various high-power applications.

No. of Terminals: 3

With 3 terminals, the design supports simpler connection and less complex circuit layouts.

Maximum Power Dissipation (Abs): 190 W

A high power dissipation rating of 190 W indicates efficient thermal handling, reducing the need for additional cooling solutions.

Package Style (Meter): IN-LINE

In-line package style benefits designs that require linear layout configurations, optimizing space and routing.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and fast switching capabilities, making this FET ideal for various applications.

Maximum Operating Temperature: 150 °C

An operating temperature of up to 150 °C ensures reliability in high-temperature environments, extending device lifespan.

Transistor Element Material: SILICON

Silicon as the element material guarantees good thermal conductivity and reliable electrical performance.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides excellent solderability and corrosion resistance, improving long-term reliability.

Maximum Drain-Source On Resistance: 0.079 ohm

Low on-resistance minimizes power losses during operation, enhancing efficiency in power management applications.

Terminal Position: SINGLE

Single terminal positioning simplifies mounting and integration into circuits, facilitating easier assembly.

Technical Specifications

Power Field Effect Transistors (FET) STI42N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

950 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.079 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

132 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI42N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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