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STI45N10F7

STMicroelectronics

STI45N10F7 by STMicroelectronics

STI45N10F7 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 45 A, a breakdown voltage of 100 V, and low on-resistance of 0.018 Ω. Ideal for power management in various electronic devices.

Median Price

$1.176

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 630 parts In-Stock

1+ parts

$2.640

100+ parts

$1.189

1k+ parts

$0.964

10k+ parts

-

630

$2.640

$1.189

$0.964

-

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

-

100+ parts

$0.947

1k+ parts

$0.947

10k+ parts

$0.947

30

-

$0.947

$0.947

$0.947

Verical

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$1.176

1k+ parts

$1.176

10k+ parts

$1.176

30

-

$1.176

$1.176

$1.176

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,985 parts In-Stock

1+ parts

$2.954

100+ parts

-

1k+ parts

-

10k+ parts

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3,985

$2.954

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-

-

Vyrian

USA . 7,214 parts In-Stock

1+ parts

-

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-

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7,214

-

-

-

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Anansix

USA . 2,601 parts In-Stock

1+ parts

-

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2,601

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-

-

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Bristol Electronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.271

1k+ parts

-

10k+ parts

-

100

-

$1.271

-

-

Dan-Mar Components

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 210 parts In-Stock

1+ parts

$1.122

100+ parts

-

1k+ parts

$1.010

10k+ parts

-

210

$1.122

-

$1.010

-

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$1.345

100+ parts

$1.224

1k+ parts

$1.103

10k+ parts

-

870

$1.345

$1.224

$1.103

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MKK Technologies

India . 872 parts In-Stock

1+ parts

$2.111

100+ parts

-

1k+ parts

-

10k+ parts

-

872

$2.111

-

-

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DigiPath Technology Company

USA . 872 parts In-Stock

1+ parts

$2.111

100+ parts

-

1k+ parts

-

10k+ parts

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872

$2.111

-

-

-

Corphita

USA . 3,087 parts In-Stock

1+ parts

$2.799

100+ parts

-

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3,087

$2.799

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-

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Microchip USA

USA . 398 parts In-Stock

1+ parts

$15.535

100+ parts

-

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398

$15.535

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-

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

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100+ parts

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 21,211 parts In-Stock

1+ parts

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21,211

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

-

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A-Z Elektronik GmbH

Germany . 6,879 parts In-Stock

1+ parts

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100+ parts

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6,879

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-

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Alle Elektronik GmbH

Germany . 4,335 parts In-Stock

1+ parts

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100+ parts

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4,335

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Perfect Parts

USA . 280 parts In-Stock

1+ parts

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-

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280

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Parana Technologies

USA . 231 parts In-Stock

1+ parts

-

100+ parts

$1.342

1k+ parts

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10k+ parts

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231

-

$1.342

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Component Stockers USA

USA . 53 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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53

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Overview

Unlock unparalleled performance with the STI45N10F7 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET is engineered for superior efficiency and reliability in demanding applications, making it ideal for high-performance switching tasks. With its robust design and built-in diode, you can trust this transistor to deliver consistent results while driving your projects forward. Elevate your designs with STMicroelectronics—where quality meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and better performance, especially in switching applications, providing enhanced control.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved protection and performance in applications where reverse voltage may occur, increasing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficiency, ideal for power management scenarios.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage ensures the transistor can handle significant voltage without degradation, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier assembly and integration into various circuit layouts, enhancing design flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of handling during assembly, ensuring stability in circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides improved control and allows for a higher degree of precision in switching applications.

Maximum Pulsed Drain Current (IDM): 180 A

The capability to handle high pulsed currents makes this FET ideal for robust applications where peak performance is critical.

Avalanche Energy Rating (EAS): 190 mJ

A higher avalanche energy rating indicates the ability to endure transient conditions without failure, adding to the product's reliability.

No. of Terminals: 3

Three terminals simplify the design and implementation, providing straightforward connections in various circuits.

Package Style (Meter): IN-LINE

In-line packaging allows for efficient use of space on circuit boards, optimizing layout designs and enhancing manufacturability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in high input impedance and low power consumption, making this transistor efficient for a wide range of applications.

Transistor Element Material: SILICON

Silicon components exhibit excellent thermal stability and performance, ensuring the product can operate effectively at various temperatures.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this FET to function in extreme environments, enhancing versatility in applications.

Maximum Drain Current (ID): 45 A

A maximum drain current of 45 A provides significant power handling capabilities, making the device suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.018 ohm

Low on-resistance minimizes power losses during operation, improving efficiency and performance in power management applications.

Terminal Position: SINGLE

A single terminal position simplifies integration into circuits, making it easier for designers to implement this FET.

Case Connection: DRAIN

Direct connection to the drain ensures effective flow of current, supporting reliable and efficient circuit operation.

Technical Specifications

Power Field Effect Transistors (FET) STI45N10F7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

190 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

180 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI45N10F7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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