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STI18N65M5

STMicroelectronics

STI18N65M5 by STMicroelectronics

STI18N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 60A IDM, 210mJ EAS, and 0.22 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 110W at 150 °C.

Median Price

$3.942

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 404 parts In-Stock

1+ parts

$3.942

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404

$3.942

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Vyrian

USA . 12,286 parts In-Stock

1+ parts

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12,286

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Anansix

USA . 619 parts In-Stock

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619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$1.361

100+ parts

-

1k+ parts

$1.225

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-

1,620

$1.361

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$1.225

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MKK Technologies

India . 1,876 parts In-Stock

1+ parts

$2.559

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1,876

$2.559

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

$2.559

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1,876

$2.559

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Corphita

USA . 3,400 parts In-Stock

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$3.735

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3,400

$3.735

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Microchip USA

USA . 7,493 parts In-Stock

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$26.715

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7,493

$26.715

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Component Stockers USA

USA . 314 parts In-Stock

1+ parts

$99.990

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314

$99.990

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Parana Technologies

USA . 2,066 parts In-Stock

1+ parts

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100+ parts

$1.627

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2,066

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$1.627

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Alle Elektronik GmbH

Germany . 700 parts In-Stock

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700

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Overview

Unlock the power of cutting-edge technology with the STI18N65M5 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability in their Power Field Effect Transistors. Ideal for switching applications, this N-channel transistor offers a minimum DS breakdown voltage of 650V and a maximum pulsed drain current of 60A, ensuring optimal performance. With a package style of IN-LINE and a maximum operating temperature of 150 °C, this transistor provides unmatched value and efficiency to customers in a variety of electronic applications. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the transistor, ensuring long-term reliability and stable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better efficiency and performance compared to P-channel transistors in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow, enhancing the overall efficiency of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power consumption for improved performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage of 650V, this transistor can handle high voltage spikes and surges, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and installation in various electronic circuits and systems.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure and reliable connection to the circuit board, enhancing the overall stability of the system.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and performance characteristics in switching applications, making them a preferred choice for many electronic designs.

Maximum Pulsed Drain Current (IDM): 60 A

With a high pulsed drain current rating of 60A, this transistor can handle large current surges without compromising its performance or reliability.

Avalanche Energy Rating (EAS): 210 mJ

The high avalanche energy rating of 210mJ ensures that the transistor can withstand high-energy pulses and spikes, improving its overall durability and longevity.

No. of Terminals: 3

Having 3 terminals allows for easy integration into existing circuit designs and provides flexibility in connecting the transistor to other components.

Maximum Power Dissipation (Abs): 110 W

With a maximum power dissipation rating of 110W, this transistor can handle high power loads and maintain stable operation under heavy-duty applications.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and space-saving design, ideal for applications where board space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved efficiency, low power consumption, and high reliability, making this transistor a cost-effective and reliable choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can operate effectively in high-temperature environments without overheating or degrading its performance.

Transistor Element Material: SILICON

Silicon transistors are known for their high performance, reliability, and durability, making them a popular choice for a wide range of electronic applications.

Maximum Drain Current (ID): 15 A

With a maximum drain current rating of 15A, this transistor can handle moderate to high current loads with ease, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.22 ohm

Having a low drain-source on resistance of 0.22 ohm ensures minimal power loss and heat dissipation, resulting in improved efficiency and performance.

Terminal Position: SINGLE

A single terminal position simplifies the installation and connection process, making it easier to integrate the transistor into existing circuit designs.

Case Connection: DRAIN

The drain connection allows for easy and efficient heat dissipation, ensuring that the transistor remains cool and stable during operation.

Technical Specifications

Power Field Effect Transistors (FET) STI18N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI18N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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