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STI16N65M5

STMicroelectronics

STI16N65M5 by STMicroelectronics

STI16N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS breakdown voltage, 48A IDM, and 0.279 ohm RDS(on). Ideal for SWITCHING applications due to its 90W power dissipation and ENHANCEMENT MODE operation. Package style is IN-LINE with PLASTIC/EPOXY body material.

Median Price

$1.792

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.286

100+ parts

-

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50

$0.286

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Digiode

USA . 317 parts In-Stock

1+ parts

$4.398

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-

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317

$4.398

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Vyrian

USA . 6,781 parts In-Stock

1+ parts

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6,781

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Anansix

USA . 1,049 parts In-Stock

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1,049

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Bristol Electronics

USA . 50 parts In-Stock

1+ parts

-

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$1.792

1k+ parts

$1.792

10k+ parts

$1.792

50

-

$1.792

$1.792

$1.792

Microfarads

USA . 48 parts In-Stock

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48

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,165 parts In-Stock

1+ parts

$0.286

100+ parts

-

1k+ parts

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$0.280

6,165

$0.286

-

-

$0.280

Argo Parts USA

USA . 3,835 parts In-Stock

1+ parts

$0.286

100+ parts

-

1k+ parts

-

10k+ parts

$0.277

3,835

$0.286

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-

$0.277

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.286

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-

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50

$0.286

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IDEA Electronic Components Group

UK . 2,308 parts In-Stock

1+ parts

$1.691

100+ parts

-

1k+ parts

$1.522

10k+ parts

-

2,308

$1.691

-

$1.522

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MKK Technologies

India . 371 parts In-Stock

1+ parts

$3.180

100+ parts

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371

$3.180

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DigiPath Technology Company

USA . 371 parts In-Stock

1+ parts

$3.180

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371

$3.180

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Ampacity Inc.

Singapore . 573 parts In-Stock

1+ parts

$3.940

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573

$3.940

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Corphita

USA . 1,658 parts In-Stock

1+ parts

$4.167

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1,658

$4.167

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$15.327

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223

$15.327

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Microchip USA

USA . 9,315 parts In-Stock

1+ parts

$22.750

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9,315

$22.750

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Component Stockers USA

USA . 659 parts In-Stock

1+ parts

$99.990

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659

$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Parana Technologies

USA . 1,410 parts In-Stock

1+ parts

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$2.022

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1,410

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$2.022

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Perfect Parts

USA . 1,114 parts In-Stock

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1,114

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Alle Elektronik GmbH

Germany . 940 parts In-Stock

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940

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Overview

Unleash the power of innovation with the STI16N65M5 by STMicroelectronics, a cutting-edge Power Field Effect Transistor designed for superior performance in switching applications. With a solid reputation for quality and reliability, STMicroelectronics delivers a product that exceeds expectations. Whether you're looking to enhance your electronic projects or streamline your power management systems, this N-CHANNEL transistor offers unparalleled value, efficiency, and durability. Trust STMicroelectronics to provide you with the tools you need to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to damage, making the FET a long-lasting choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer low resistance and high efficiency, making them ideal for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reliable and efficient current flow in one direction, enhancing the performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid changes in voltage and current.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can withstand high voltages, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, ideal for applications with limited space.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer secure connections and easy installation, making this FET user-friendly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer improved efficiency and performance compared to depletion mode FETs.

Maximum Pulsed Drain Current (IDM): 48 A

With a high pulsed drain current rating, this FET can handle short-duration spikes in current without damage.

Avalanche Energy Rating (EAS): 200 mJ

The high avalanche energy rating ensures that this FET can withstand sudden voltage surges without breakdown.

Maximum Drain Current (Abs) (ID): 12 A

This FET can safely handle up to 12 amps of continuous current, making it suitable for medium to high-power applications.

Maximum Power Dissipation (Abs): 90 W

With a high power dissipation rating, this FET can handle higher power levels without overheating.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing circuit designs, simplifying the installation process.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high-speed switching and low gate drive power requirements, making this FET efficient and reliable.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can perform consistently in a wide range of environmental conditions.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, ensuring long-term stability for the FET.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides corrosion resistance and a secure connection, enhancing the durability of the FET.

Maximum Drain-Source On Resistance: 0.279 ohm

With a low on-resistance, this FET minimizes power loss and heat generation, improving overall efficiency.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and allows for easy connection to external circuitry.

Technical Specifications

Power Field Effect Transistors (FET) STI16N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.279 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI16N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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