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STI12N65M5

STMicroelectronics

STI12N65M5 by STMicroelectronics

STI12N65M5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 34A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,215 parts In-Stock

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Digiode

USA . 3,884 parts In-Stock

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3,884

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R&J Components

USA . 950 parts In-Stock

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950

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Anansix

USA . 357 parts In-Stock

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357

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 852 parts In-Stock

1+ parts

$0.451

100+ parts

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$0.406

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852

$0.451

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$0.406

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MKK Technologies

India . 1,391 parts In-Stock

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$0.848

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$0.848

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DigiPath Technology Company

USA . 1,391 parts In-Stock

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$0.848

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1,391

$0.848

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Alle Elektronik GmbH

Germany . 4,303 parts In-Stock

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Perfect Parts

USA . 2,218 parts In-Stock

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Corphita

USA . 1,625 parts In-Stock

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Parana Technologies

USA . 576 parts In-Stock

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$0.539

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576

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$0.539

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Cyclops Electronics Ltd (Excess)

UK . 40 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the STI12N65M5 power FET from STMicroelectronics. Renowned for its quality and innovation, STMicroelectronics delivers a robust solution ideal for high-voltage switching applications. With its remarkable durability and exceptional energy management, this N-channel FET empowers your designs while ensuring reliability and longevity. Elevate your projects with the trusted excellence of STMicroelectronics and experience unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides a durable and lightweight option, ensuring good insulation and protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher performance, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design, enhancing reliability and reducing the number of external components necessary.

Transistor Application: SWITCHING

Designed for switching purposes, this FET is optimized for quick response times, making it suitable for various electronic applications.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage rating signifies the ability to operate in high-voltage environments, providing robustness in demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape is standard in many applications, allowing for easy integration into existing designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical stability and are well-suited for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the device's conduction state, enhancing efficiency.

Maximum Pulsed Drain Current (IDM): 34 A

A maximum pulsed drain current of 34 A allows the FET to handle high transient loads, making it reliable for various solutions.

Avalanche Energy Rating (EAS): 150 mJ

The rated avalanche energy provides additional reliability against transient conditions, ensuring safe operation.

Maximum Drain Current (Abs) (ID): 8.5 A

With a maximum drain current rating of 8.5 A, this FET can handle significant load currents, making it suitable for various power applications.

No. of Terminals: 3

Having three terminals allows for versatile circuit configurations, facilitating easier design and integration.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation capability means better handling of heat, increasing the reliability of the device in demanding applications.

Package Style (Meter): IN-LINE

An in-line package style allows for straightforward integration into PCB layouts, optimizing space utilization.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-density integration, low power consumption, and excellent switching characteristics.

Maximum Operating Temperature: 150 °C

A high operating temperature capability makes this FET suitable for use in harsh environments and demanding applications.

Transistor Element Material: SILICON

Silicon as the element material ensures good thermal conductivity and performance in various operating conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability and corrosion resistance, enhancing the longevity of the connections.

Maximum Drain Current (ID): 8.5 A (repeat)

This reinforces the device's suitability for handling significant power loads in various applications.

Maximum Drain-Source On Resistance: 0.43 ohm

A low on-resistance rating minimizes power loss, increasing efficiency and performance of the device.

Terminal Position: SINGLE

Having a single terminal position simplifies board layout and enhances the compactness of the design.

Technical Specifications

Power Field Effect Transistors (FET) STI12N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

8.5 A

Maximum Drain Current (ID):

8.5 A

Maximum Drain-Source On Resistance:

.43 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI12N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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