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STI13NM60N

STMicroelectronics

STI13NM60N by STMicroelectronics

STI13NM60N by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage, 44A IDM, and 0.36 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with 11A ID and 90W power dissipation.

Median Price

$2.880

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 883 parts In-Stock

1+ parts

$2.880

100+ parts

$1.260

1k+ parts

$0.913

10k+ parts

$0.859

883

$2.880

$1.260

$0.913

$0.859

Avnet

USA . 3,000 parts In-Stock

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3,000

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Digiode

USA . 1,518 parts In-Stock

1+ parts

$1.758

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-

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1,518

$1.758

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Sensible Micro Corp

USA . 30,000 parts In-Stock

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30,000

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Vyrian

USA . 9,199 parts In-Stock

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9,199

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Anansix

USA . 1,661 parts In-Stock

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1,661

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R&J Components

USA . 750 parts In-Stock

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750

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Elcom Components

USA . 239 parts In-Stock

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239

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 533 parts In-Stock

1+ parts

$0.383

100+ parts

-

1k+ parts

$0.344

10k+ parts

-

533

$0.383

-

$0.344

-

MKK Technologies

India . 2,304 parts In-Stock

1+ parts

$0.720

100+ parts

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2,304

$0.720

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DigiPath Technology Company

USA . 2,304 parts In-Stock

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$0.720

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2,304

$0.720

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Corphita

USA . 4,681 parts In-Stock

1+ parts

$1.665

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4,681

$1.665

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Microchip USA

USA . 4,704 parts In-Stock

1+ parts

$13.845

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4,704

$13.845

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iodParts Technologies Inc.

India . 120,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 7,100 parts In-Stock

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7,100

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Alle Elektronik GmbH

Germany . 3,212 parts In-Stock

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3,212

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Perfect Parts

USA . 2,240 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,799 parts In-Stock

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1,799

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Parana Technologies

USA . 1,057 parts In-Stock

1+ parts

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100+ parts

$0.458

1k+ parts

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1,057

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$0.458

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Overview

Elevate your power management solutions with the STI13NM60N by STMicroelectronics. Crafted with precision and quality in mind, this N-channel Power FET offers seamless switching capabilities ideal for a variety of applications. With a robust design and high performance features, this transistor provides customers with unparalleled value and reliability. Whether you're looking to optimize your power systems or enhance your electronic designs, the STI13NM60N delivers exceptional benefits and advantages that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Minimum DS Breakdown Voltage: 600 V

Capable of handling high voltage applications with a breakdown voltage of 600V, ensuring safety and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easier control of the switching process, improving efficiency and performance.

Maximum Pulsed Drain Current (IDM): 44 A

High maximum pulsed drain current of 44A enables the FET to handle power spikes and surges effectively.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating of 200mJ ensures protection against breakdown under high-energy conditions.

Maximum Power Dissipation (Abs): 90 W

With a maximum power dissipation of 90W, this FET can handle high-power applications without overheating.

Maximum Operating Temperature: 150 °C

Can operate effectively in high-temperature environments up to 150 °C, providing versatility in various applications.

Technical Specifications

Power Field Effect Transistors (FET) STI13NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI13NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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