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STGWA45HF60WDI

STMicroelectronics

STGWA45HF60WDI by STMicroelectronics

STGWA45HF60WDI from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max power dissipation of 310 W, operates up to 150 °C, and supports voltages up to 600 V. Ideal for applications requiring robust performance in demanding environments.

Median Price

$5.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 551 parts In-Stock

1+ parts

$5.900

100+ parts

$4.677

1k+ parts

$3.563

10k+ parts

-

551

$5.900

$4.677

$3.563

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,275 parts In-Stock

1+ parts

$5.605

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$5.605

-

-

-

Vyrian

USA . 8,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,879

-

-

-

-

R&J Components

USA . 595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

595

-

-

-

-

Anansix

USA . 563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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563

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$0.915

100+ parts

-

1k+ parts

$0.824

10k+ parts

-

965

$0.915

-

$0.824

-

MKK Technologies

India . 247 parts In-Stock

1+ parts

$1.721

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$1.721

-

-

-

DigiPath Technology Company

USA . 247 parts In-Stock

1+ parts

$1.721

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$1.721

-

-

-

Semicontronic

India . 139 parts In-Stock

1+ parts

$5.020

100+ parts

$4.894

1k+ parts

$4.869

10k+ parts

-

139

$5.020

$4.894

$4.869

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Corphita

USA . 2,570 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

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2,570

$5.310

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Microchip USA

USA . 7,742 parts In-Stock

1+ parts

$16.352

100+ parts

-

1k+ parts

-

10k+ parts

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7,742

$16.352

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-

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Perfect Parts

USA . 1,310 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,310

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-

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Parana Technologies

USA . 634 parts In-Stock

1+ parts

-

100+ parts

$1.094

1k+ parts

-

10k+ parts

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634

-

$1.094

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-

Overview

Unlock unparalleled efficiency with the STGWA45HF60WDI from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance IGBT promises enhanced power control and reliability across a myriad of applications, from renewable energy systems to industrial machinery. Its robust design ensures exceptional thermal management, providing customers with durability and peace of mind. Choose STMicroelectronics for quality you can trust and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent insulation properties and mechanical strength, making this IGBT durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower on-state voltage drops and higher efficiency, making them a preferred choice for power control in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances overall efficiency by allowing for faster switching and recovery times, which is critical in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT can handle demanding operational conditions, providing reliability in high-power circuits.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and integration into various circuit designs, ensuring better space utilization and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and robust connections in high power applications, allowing for strong electrical performance and stability.

No. of Terminals: 3

The three-terminal design makes this IGBT versatile for different circuit configurations, enabling easy integration in various designs.

Maximum Power Dissipation (Abs): 310 W

With a maximum power dissipation rating of 310 W, this IGBT is capable of handling substantial energy, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style ensures secure installation and optimized thermal management, crucial for maintaining performance under high power conditions.

Maximum Operating Temperature: 150 °C

Operating at high temperatures up to 150 °C allows for flexibility in design and operation in demanding environments without thermal breakdown.

Maximum Collector-Emitter Voltage: 600 V

A maximum voltage rating of 600 V makes this IGBT suitable for a wide range of high-voltage applications, enhancing its usability in industrial settings.

Transistor Element Material: SILICON

Silicon is a well-established semiconductor material that offers excellent electrical properties, ensuring reliable performance in high-power circuitry.

Maximum Gate-Emitter Voltage: 20 V

This gate-emitter voltage limit of 20 V supports efficient operation and control, preventing damage and ensuring long-lasting performance under various conditions.

Maximum Collector Current (IC): 80 A

With a collector current rating of 80 A, this IGBT is capable of handling heavy loads, making it ideal for applications requiring significant power delivery.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A threshold voltage of 5.75 V indicates efficient switching operations and lower power consumption in control signals, improving overall system efficiency.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and corrosion resistance, ensuring reliable connections in various environmental conditions.

Terminal Position: SINGLE

The single terminal position design simplifies circuit layout and minimizes the potential for errors during assembly, improving reliability in applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA45HF60WDI attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Trade Compliance

STGWA45HF60WDI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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