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STGWA40HP65FB

STMicroelectronics

STGWA40HP65FB by STMicroelectronics

STGWA40HP65FB from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2V, supports up to 80A collector current, and operates in temperatures from -55 °C to 175 °C. Its robust design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,771 parts In-Stock

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6,771

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Digiode

USA . 4,358 parts In-Stock

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4,358

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Anansix

USA . 971 parts In-Stock

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971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,290 parts In-Stock

1+ parts

$1.659

100+ parts

-

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$1.493

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2,290

$1.659

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$1.493

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MKK Technologies

India . 1,890 parts In-Stock

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$3.119

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1,890

$3.119

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DigiPath Technology Company

USA . 1,890 parts In-Stock

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$3.119

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1,890

$3.119

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Microchip USA

USA . 4,103 parts In-Stock

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$14.643

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4,103

$14.643

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AZTECH Wire

Italy . 122 parts In-Stock

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$16.680

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122

$16.680

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 1,983 parts In-Stock

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1,983

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Parana Technologies

USA . 347 parts In-Stock

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$1.983

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347

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$1.983

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Overview

Elevate your power control solutions with the STGWA40HP65FB IGBT from STMicroelectronics. Renowned for its cutting-edge technology and reliability, STMicroelectronics ensures optimal performance in demanding applications. This N-channel transistor delivers exceptional efficiency, with a robust thermal range and built-in diode for added versatility. Trust in ST's commitment to quality to enhance your systems with superior power management and unwavering performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers durability and reliability, making the IGBT suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration provides high electron mobility, enhancing the overall efficiency in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for external components, thus saving space and reducing costs.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for applications requiring high efficiency and perform well under high load conditions.

Maximum VCEsat: 2 V

Low VCEsat indicates less power loss during operation, improving overall system efficiency and heat management.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to implement in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and enhance soldering quality, making the IGBT suitable for high-reliability applications.

Nominal Turn Off Time (toff): 202 ns

A fast turn-off time improves switching performance, making this IGBT ideal for high-frequency applications.

No. of Terminals: 3

The three-terminal design simplifies integration into circuits while allowing for effective control and connectivity.

Maximum Power Dissipation (Abs): 283 W

High power dissipation capability ensures that this IGBT can handle demanding applications without failure.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides sturdy installation options, improving thermal management and promoting reliability in high-power settings.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows the IGBT to perform reliably in harsh environments, expanding its application range.

Maximum Collector-Emitter Voltage: 650 V

With a high voltage rating, this IGBT can be employed in various high-voltage applications without risk of breakdown.

Transistor Element Material: SILICON

Using silicon for the transistor element contributes to the device's thermal stability and performance over a wide range of operating conditions.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage limit provides flexible drive options, ensuring compatibility with various control circuits.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures reliable operation in extreme environments, making it suitable for automotive and aerospace applications.

Maximum Collector Current (IC): 80 A

The ability to handle high collector current enhances performance in demanding power applications, ensuring operational reliability.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate threshold voltage simplifies drive circuitry, making integration into existing systems easier and cost-effective.

Terminal Position: SINGLE

Single terminal positioning allows for easy installation and better management of PCB space.

Case Connection: COLLECTOR

Direct collector connection provides enhanced thermal management and improved electrical performance, essential for high-power applications.

Nominal Turn On Time (ton): 169 ns

Fast turn-on time facilitates quick switching, which is essential for high-efficiency power converters.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA40HP65FB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

202 ns

Nominal Turn On Time (ton):

169 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWA40HP65FB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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