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STGW40H65DFB-4

STMicroelectronics

STGW40H65DFB-4 by STMicroelectronics

STGW40H65DFB-4 IGBT from STMicroelectronics features a max VCEsat of 2V, supports up to 80A collector current, and operates at temperatures from -55 °C to 175 °C. Ideal for power control applications, it ensures efficient performance in demanding environments. Its robust design includes a built-in diode for enhanced reliability.

Median Price

$3.780

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 30 parts In-Stock

1+ parts

$2.310

100+ parts

$2.230

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$2.140

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-

30

$2.310

$2.230

$2.140

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DigiKey

USA . 534 parts In-Stock

1+ parts

$5.250

100+ parts

$2.948

1k+ parts

$2.068

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-

534

$5.250

$2.948

$2.068

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Avnet

USA . 600 parts In-Stock

1+ parts

-

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600

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EBV Elektronik

Germany . 30 parts In-Stock

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30

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Distributors (In-Stock)

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Digiode

USA . 2,149 parts In-Stock

1+ parts

$4.921

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2,149

$4.921

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Vyrian

USA . 6,897 parts In-Stock

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6,897

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Anansix

USA . 520 parts In-Stock

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520

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IBS Electronics

USA . 30 parts In-Stock

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-

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$3.128

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$3.100

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30

-

$3.128

$3.100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,247 parts In-Stock

1+ parts

$0.663

100+ parts

-

1k+ parts

$0.597

10k+ parts

-

1,247

$0.663

-

$0.597

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MKK Technologies

India . 176 parts In-Stock

1+ parts

$1.247

100+ parts

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176

$1.247

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DigiPath Technology Company

USA . 176 parts In-Stock

1+ parts

$1.247

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176

$1.247

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Corphita

USA . 1,889 parts In-Stock

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$4.662

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1,889

$4.662

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QUARKTWIN TECHNOLOGY LTD

USA . 19,576 parts In-Stock

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Microchip USA

USA . 4,471 parts In-Stock

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4,471

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Perfect Parts

USA . 840 parts In-Stock

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840

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Parana Technologies

USA . 309 parts In-Stock

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$0.793

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309

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$0.793

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iodParts Technologies Inc.

India . 34 parts In-Stock

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34

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Overview

Unlock superior power control with the STGW40H65DFB-4 from STMicroelectronics, a leader in semiconductor innovation. This high-performance IGBT promises exceptional efficiency and reliability, making it ideal for demanding applications like motor drives and renewable energy systems. With its robust design and built-in diode, this component ensures durable operation even in extreme conditions, empowering your projects with enhanced performance and longevity. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures a robust design, making the IGBT reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel types are known for their high switching speeds and efficiency, making this IGBT suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances performance by allowing for quick recovery and improved efficiency in power control.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is optimized for handling high power applications effectively.

Maximum VCEsat: 2 V

A low VCEsat improves efficiency by reducing energy loss during switching, making this IGBT more energy-efficient.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier integration into various circuit designs and improves space efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy connections, ensuring reliability under mechanical stress in diverse applications.

Nominal Turn Off Time (toff): 209 ns

A fast turn-off time enhances the overall switching performance, beneficial for applications that require rapid switching.

No. of Terminals: 4

Four terminals allow for flexible circuit designs and make implementation straightforward in various applications.

Maximum Power Dissipation (Abs): 283 W

High power dissipation capability ensures the IGBT can manage substantial power loads, making it ideal for industrial applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for better thermal management and stability in high-power environments.

Maximum Operating Temperature: 175 °C

A high operating temperature range allows for use in demanding environments, ensuring reliable performance.

Maximum Collector-Emitter Voltage: 650 V

A high collector-emitter voltage rating expands application possibilities, allowing for use in various high-voltage situations.

Transistor Element Material: SILICON

Silicon as the base material ensures good thermal conductivity and adequate performance in high-speed applications.

Maximum Gate-Emitter Voltage: 20 V

This voltage capacity allows for compatibility with a wider range of driving circuits, enhancing flexibility in designs.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature makes this product suitable for use in extreme cold environments.

Maximum Collector Current (IC): 80 A

High collector current allows for efficient operation in heavy-duty applications, providing substantial power handling.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate threshold voltage ensures effective gate control while reducing power losses during operation.

Terminal Position: SINGLE

Single terminal position allows for straightforward connection and integration into various circuit designs.

Case Connection: COLLECTOR

Collector connection ensures efficient transfer of current within the circuit, enhancing performance in power applications.

Nominal Turn On Time (ton): 54.8 ns

Fast turn-on time contributes to high-frequency operation, making the IGBT suitable for modern power electronics.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW40H65DFB-4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

209 ns

Nominal Turn On Time (ton):

54.8 ns

Maximum VCEsat:

2 V

Trade Compliance

STGW40H65DFB-4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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