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STGSB200M65DF2AG

STMicroelectronics

STGSB200M65DF2AG by STMicroelectronics

STGSB200M65DF2AG from STMicroelectronics is a high-performance N-channel IGBT designed for power control applications. It features a max VCEsat of 2.05V, supports up to 216A collector current, and operates in temperatures from -55 °C to 175 °C. Its compact surface mount design ensures efficient thermal management and reliability.

Median Price

$17.735

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 49 parts In-Stock

1+ parts

$16.550

100+ parts

$13.420

1k+ parts

$12.280

10k+ parts

-

49

$16.550

$13.420

$12.280

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DigiKey

USA . 103 parts In-Stock

1+ parts

$18.920

100+ parts

-

1k+ parts

$12.284

10k+ parts

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103

$18.920

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$12.284

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Verical

USA . 10 parts In-Stock

1+ parts

-

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-

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10

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Distributors (In-Stock)

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Digiode

USA . 3,468 parts In-Stock

1+ parts

$15.722

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-

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3,468

$15.722

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Vyrian

USA . 5,494 parts In-Stock

1+ parts

-

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5,494

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Anansix

USA . 1,455 parts In-Stock

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1,455

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Martec Srl

Italy . 232 parts In-Stock

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232

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,862 parts In-Stock

1+ parts

$0.949

100+ parts

-

1k+ parts

$0.854

10k+ parts

-

1,862

$0.949

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$0.854

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MKK Technologies

India . 611 parts In-Stock

1+ parts

$1.784

100+ parts

-

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611

$1.784

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DigiPath Technology Company

USA . 611 parts In-Stock

1+ parts

$1.784

100+ parts

-

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611

$1.784

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Corphita

USA . 1,760 parts In-Stock

1+ parts

$14.895

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1,760

$14.895

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Parana Technologies

USA . 1,037 parts In-Stock

1+ parts

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100+ parts

$1.134

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1,037

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$1.134

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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50

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Eastek

USA . 10 parts In-Stock

1+ parts

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100+ parts

$22.330

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10

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$22.330

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Overview

Unlock unparalleled efficiency and reliability in your power control applications with the STGSB200M65DF2AG from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers cutting-edge IGBTs that excel in demanding environments, achieving high performance with minimal losses. With robust thermal management and a compact design, this device ensures seamless integration into automotive and industrial systems, empowering your innovations while enhancing energy efficiency and operational longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resilience in various applications, making it suitable for harsh environments.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration is ideal for higher efficiency in power applications, allowing for greater current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance by providing additional functionalities without requiring extra components.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can handle high voltages and currents, making it perfect for demanding applications.

Surface Mount: YES

Surface mounting capability allows for compact designs and easy integration into modern electronic assemblies.

Maximum VCEsat: 2.05 V

A low saturation voltage improves efficiency and reduces power loss during operation, enhancing overall system performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCB layouts, allowing for more compact and organized designs.

Terminal Form: GULL WING

Gull wing terminals provide reliable connections and easy soldering, improving assembly efficiency and product reliability.

Nominal Turn Off Time (toff): 412.6 ns

A fast turn off time ensures quick response in switching applications, enhancing dynamic performance in power electronics.

No. of Terminals: 9

With nine terminals, the product supports versatile connections and helps facilitate complex circuit designs.

Maximum Power Dissipation (Abs): 714 W

A high power dissipation rating allows the IGBT to manage more power without overheating, making it suitable for high-load applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, providing a compact solution.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this IGBT can operate reliably in high-temperature environments, ensuring durability.

Maximum Collector-Emitter Voltage: 650 V

The capability to handle up to 650 V allows it to be used in high-voltage applications, expanding its usability in various sectors.

Transistor Element Material: SILICON

Silicon is a well-established semiconductor material known for its efficiency and reliability in power transistor applications.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V provides robust control and flexibility in driving the IGBT, improving circuit design options.

Minimum Operating Temperature: -55 °C

The ability to operate at a minimum temperature of -55 °C ensures that this IGBT performs well in cold environments, beneficial in various applications.

Maximum Collector Current (IC): 216 A

A high maximum collector current means this IGBT can handle substantial loads, making it ideal for heavy-duty applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

The threshold voltage allows for efficient control of the IGBT, optimizing switching performance in circuits.

Terminal Position: DUAL

Dual terminal positioning enhances connection stability, providing better mounting options on circuit boards.

Case Connection: ISOLATED

Isolated case connection helps in reducing the risk of short circuits and creates safer operational conditions.

Nominal Turn On Time (ton): 193.6 ns

A short turn on time allows for faster switching, improving efficiency and reducing losses in switching applications.

Reference Standard: AEC-Q101; UL RECOGNIZED

Compliance with recognized standards ensures that the IGBT meets strict quality and safety criteria, instilling confidence in its reliability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGSB200M65DF2AG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PDSO-G9

No. of Elements:

1

No. of Terminals:

9

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101; UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

412.6 ns

Nominal Turn On Time (ton):

193.6 ns

Maximum VCEsat:

2.05 V

Trade Compliance

STGSB200M65DF2AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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