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STG4259

STMicroelectronics

STG4259 by STMicroelectronics

STG4259 by STMicroelectronics is a CMOS SPDT switch with a max supply voltage of 4.8V and an on-state resistance of just 0.65Ω. It operates in industrial environments, with a temp range of -40 °C to 85 °C. Ideal for compact applications due to its very thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,953 parts In-Stock

1+ parts

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3,953

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Anansix

USA . 463 parts In-Stock

1+ parts

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463

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Digiode

USA . 64 parts In-Stock

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64

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,085 parts In-Stock

1+ parts

$15.235

100+ parts

-

1k+ parts

$13.712

10k+ parts

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1,085

$15.235

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$13.712

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MKK Technologies

India . 776 parts In-Stock

1+ parts

$28.649

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776

$28.649

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DigiPath Technology Company

USA . 776 parts In-Stock

1+ parts

$28.649

100+ parts

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776

$28.649

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Parana Technologies

USA . 1,672 parts In-Stock

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$18.216

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1,672

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$18.216

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Corphita

USA . 1,325 parts In-Stock

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1,325

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Overview

Unlock the potential of your designs with the STG4259 from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This versatile multiplexer/switch delivers exceptional performance and reliability, making it perfect for industrial applications. With its ultra-low on-state resistance and robust temperature range, you can count on seamless operation even in demanding environments. Elevate your projects while benefiting from ST's commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the internal components, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a compact and efficient design, making it ideal for space-constrained environments.

No. of Functions: 2

With two functions, this product offers versatile operational capabilities while maintaining simplicity.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space usage on PCBs, enhancing design flexibility.

Nominal Supply Voltage (Vsup): 1.8 V

Operating at a low nominal voltage reduces power consumption, making it energy-efficient.

No. of Terminals: 11

Having 11 terminals allows for multiple connections, offering flexibility in circuit design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Its thin profile and fine pitch enhance the density of connections, making it perfect for advanced electronic designs.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, this product is suitable for industrial applications with challenging thermal environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, enhancing design versatility.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy integration into various types of PCBs.

Maximum Seated Height: 0.715 mm

Low seated height contributes to a compact design, ideal for slim electronic devices.

Width: 1.55 mm

Narrow width allows for placement in tight spaces without compromising functionality.

Other IC type: SPDT

The SPDT configuration supports diverse signal routing applications, providing more design options.

Minimum Supply Voltage (Vsup): 1.65 V

Allowing for lower voltage operation helps in eliminating power supply-related issues in sensitive circuits.

Maximum On-state Resistance (Ron): 0.65 ohm

Low on-state resistance minimizes power loss and heat generation, improving efficiency.

Maximum Switch-on Time: 123 ns

Fast switch-on time enhances responsiveness, making it suitable for high-speed applications.

Length: 2.068 mm

Compact length enables the product to fit in space-limited designs while maintaining performance.

Maximum Switch-off Time: 15 ns

Quick switch-off time improves overall responsiveness and performance in dynamic applications.

Temperature Grade: INDUSTRIAL

Rated for industrial application, ensuring reliability and performance in demanding environments.

Technology: CMOS

CMOS technology enables low power consumption and high performance, ideal for modern electronic applications.

Terminal Form: BALL

Ball terminal form enhances solderability and connection stability, crucial for reliable performance.

Terminal Pitch: 0.5 mm

Small pitch allows for a more compact layout, supporting dense circuit designs.

Maximum Supply Voltage (Vsup): 4.8 V

Ability to handle a relatively high maximum supply voltage expands the range of circuit applications.

Nominal Off-state Isolation: 71 dB

High isolation ensures minimal signal interference, enhancing overall circuit integrity.

Nominal On-state Resistance Match: 0.005 ohm

Excellent resistance match minimizes discrepancies in signal levels, ensuring uniform performance across circuits.

Technical Specifications

Multiplexers & Switches STG4259 attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PBGA-B11

Length:

2.068 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

11

Nominal Off-state Isolation:

71 dB

Nominal On-state Resistance Match:

.005 ohm

Maximum On-state Resistance (Ron):

.65 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.715 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

15 ns

Maximum Switch-on Time:

123 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

1.55 mm

Trade Compliance

STG4259 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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