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STG4259BJR

STMicroelectronics

STG4259BJR by STMicroelectronics

STG4259BJR by STMicroelectronics is a CMOS SPDT switch ideal for low-voltage applications, operating b/w 1.65V and 4.8V. It features a max on-state resistance of 0.65Ω, fast switching times (123ns on, 15ns off), and operates in -40 °C to 85 °C range. Its compact design suits industrial use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,496 parts In-Stock

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5,496

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Anansix

USA . 2,632 parts In-Stock

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2,632

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Digiode

USA . 690 parts In-Stock

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690

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 447 parts In-Stock

1+ parts

$2.381

100+ parts

-

1k+ parts

$2.143

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447

$2.381

-

$2.143

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MKK Technologies

India . 1,527 parts In-Stock

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$4.477

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1,527

$4.477

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DigiPath Technology Company

USA . 1,527 parts In-Stock

1+ parts

$4.477

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1,527

$4.477

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Microchip USA

USA . 289 parts In-Stock

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$8.948

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289

$8.948

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$10.426

100+ parts

$10.322

1k+ parts

$9.905

10k+ parts

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500

$10.426

$10.322

$9.905

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AZTECH Wire

Italy . 134 parts In-Stock

1+ parts

$17.940

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134

$17.940

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Corphita

USA . 4,543 parts In-Stock

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4,543

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Vigor

Singapore . 1,780 parts In-Stock

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1,780

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Parana Technologies

USA . 927 parts In-Stock

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$2.847

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927

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$2.847

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Overview

Unlock unparalleled performance with the STG4259BJR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile multiplexer brings exceptional speed and reliability to your designs, making it perfect for industrial applications where efficiency is key. With its compact size and low power consumption, it seamlessly integrates into tight spaces while delivering impressive isolation and minimal on-state resistance. Elevate your projects with STMicroelectronics' commitment to quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount compatibility allows for easier integration into modern PCBs, saving space and improving assembly efficiency.

No. of Functions: 2

With two functions, the device is versatile and can handle multiple tasks, reducing the need for extra components in a circuit.

Package Shape: RECTANGULAR

The rectangular shape is commonly used in compact designs, facilitating better layout flexibility on PCBs.

Nominal Supply Voltage (Vsup): 1.8 V

The low nominal supply voltage helps to minimize power consumption, making it ideal for battery-powered applications.

Power Supplies (V): 1.6/4

Supports a range of supply voltages, providing design flexibility for different applications.

No. of Terminals: 11

Having multiple terminals allows for more connections and complex functionality in a single device.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch design supports high-density applications, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, it can be used in harsher environments, enhancing its application range.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliability in extreme cold conditions, suitable for industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning can enhance thermal performance and allows for efficient PCB layouts.

Output (V): SEPARATE OUTPUT

Separate output configurations allow for better signal management and isolation between different circuits.

Maximum Seated Height: 0.715 mm

The low seated height contributes to a compact design, allowing for thinner devices.

Width: 1.55 mm

A narrow width makes this product ideal for space-constrained applications.

Other IC type: SPDT

Being a Single Pole Double Throw (SPDT) device expands its use cases, providing more switching options.

Minimum Supply Voltage (Vsup): 1.65 V

The minimum supply voltage is also low, enhancing compatibility with low-power circuits.

Maximum On-state Resistance (Ron): 0.65 ohm

Low on-state resistance minimizes power loss during operation, improving overall efficiency.

Maximum Switch-on Time: 123 ns

Fast switch-on time improves operational speed, making it suitable for high-speed applications.

Length: 2.068 mm

A compact length facilitates integration into small electronic devices without compromising performance.

Maximum Switch-off Time: 15 ns

Rapid switch-off time enhances operational response, critical for fast data applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures long-term reliability in challenging environments and applications.

Technology: CMOS

Using CMOS technology guarantees low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form minimizes stress on the connections, enhancing durability and reliability.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for more compact layouts while maintaining signal integrity.

Maximum Supply Voltage (Vsup): 4.8 V

The maximum supply voltage provides flexibility for design while accommodating various voltage levels.

Nominal Off-state Isolation: 71 dB

High off-state isolation ensures minimal signal interference, enhancing performance in sensitive applications.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents short circuits and ensures safe operation in various configurations.

Nominal On-state Resistance Match: 0.005 ohm

Very low on-state resistance match improves signal quality and reduces heat generation during operation.

Technical Specifications

Multiplexers & Switches STG4259BJR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PBGA-B11

Length:

2.068 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

11

Nominal Off-state Isolation:

71 dB

Nominal On-state Resistance Match:

.005 ohm

Maximum On-state Resistance (Ron):

.65 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FLIP CHIP

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.6/4

Qualification:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

15 ns

Maximum Switch-on Time:

123 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.55 mm

Trade Compliance

STG4259BJR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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