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STG4160BJR

STMicroelectronics

STG4160BJR by STMicroelectronics

STG4160BJR by STMicroelectronics is a CMOS SPDT switch with an on-state resistance of 3.7Ω and operates b/w 1.8V to 4.5V. It features an industrial temp range of -40 °C to 85 °C and supports surface mount applications in compact designs. Ideal for signal routing in various electronic devices.

Median Price

$0.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,531 parts In-Stock

1+ parts

$0.880

100+ parts

$0.692

1k+ parts

$0.499

10k+ parts

$0.442

4,531

$0.880

$0.692

$0.499

$0.442

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,093 parts In-Stock

1+ parts

$0.836

100+ parts

-

1k+ parts

-

10k+ parts

-

2,093

$0.836

-

-

-

Vyrian

USA . 3,757 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,757

$0.880

-

-

-

Chip Stock

USA . 23,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,390

-

-

-

-

Anansix

USA . 1,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,663

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,800 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

10k+ parts

-

3,800

$0.620

-

-

-

Corphita

USA . 4,794 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

-

10k+ parts

-

4,794

$0.792

-

-

-

Component Stockers USA

USA . 9,761 parts In-Stock

1+ parts

$0.860

100+ parts

$0.680

1k+ parts

$0.490

10k+ parts

-

9,761

$0.860

$0.680

$0.490

-

Microchip USA

USA . 2,115 parts In-Stock

1+ parts

$7.475

100+ parts

-

1k+ parts

-

10k+ parts

-

2,115

$7.475

-

-

-

IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$9.287

100+ parts

-

1k+ parts

$8.359

10k+ parts

-

588

$9.287

-

$8.359

-

MKK Technologies

India . 2,301 parts In-Stock

1+ parts

$17.464

100+ parts

-

1k+ parts

-

10k+ parts

-

2,301

$17.464

-

-

-

DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$17.464

100+ parts

-

1k+ parts

-

10k+ parts

-

2,301

$17.464

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Perfect Parts

USA . 9,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,937

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,425

-

-

-

-

Parana Technologies

USA . 2,023 parts In-Stock

1+ parts

-

100+ parts

$11.104

1k+ parts

-

10k+ parts

-

2,023

-

$11.104

-

-

Overview

Unlock unparalleled performance with the STG4160BJR from STMicroelectronics—a leader in innovation and reliability. This high-quality SPDT switch combines robust construction with exceptional thermal resilience, making it ideal for diverse applications in industrial settings. With its rapid switching capabilities and low on-state resistance, this multiplexer elevates efficiency while minimizing power loss. Experience enhanced functionality and peace of mind, knowing you're backed by a trusted manufacturer committed to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and protects the internal components, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for more compact designs, making it suitable for modern electronic devices with space constraints.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and optimizes space utilization on the board.

Power Supplies (V): 1.8/4.5

Wide power supply range enables compatibility with various systems and helps in energy-efficient designs.

No. of Terminals: 8

Having 8 terminals provides flexibility in design and enables multi-channel switching capabilities.

Package Style (Meter): GRID ARRAY

Grid array packaging supports higher terminal density, making it suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability in environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at very low temperatures makes this product ideal for applications in harsh environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides excellent solderability and protects against corrosion, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and facilitates efficient thermal management.

Other IC Type: SPDT

Single Pole Dual Throw (SPDT) configuration offers versatile switching capabilities, making it suitable for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable reflow time indicates effective soldering capabilities during manufacturing, enhancing production efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for compatibility with lead-free soldering processes, meeting modern industry standards.

Maximum On-state Resistance (Ron): 3.7 ohm

Low on-state resistance minimizes power losses during operation, enhancing overall performance and efficiency.

Maximum Switch-on Time: 123 ns

Fast switching times of 123 ns enable high-speed applications, making this product ideal for data communication circuits.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures performance and reliability in challenging conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it versatile.

Terminal Form: BALL

Ball terminal form ensures reliable connections and improves the ability to manage thermal and electrical stress.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is conducive to denser layouts, allowing more efficient use of PCB space in compact designs.

Normal Position (V): NO/NC

Having normally open and normally closed configurations grants flexibility in circuit design and functionality.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching ensures there is no overlap between the switched states, preventing short circuits and providing safer operation.

Technical Specifications

Multiplexers & Switches STG4160BJR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Normal Position (V):

NO/NC

No. of Functions:

1

No. of Terminals:

8

Maximum On-state Resistance (Ron):

3.7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/4.5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

123 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STG4160BJR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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