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STG4159BJR

STMicroelectronics

STG4159BJR by STMicroelectronics

STG4159BJR by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 0.65Ω and operates b/w 1.65V to 4.8V. It features a very thin profile (0.715mm) and offers excellent isolation at 69dB, ideal for industrial applications in compact designs. Its fast switching times (123ns on, 15ns off) enhance performance in signal routing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Component Sense

UK . 7,588 parts In-Stock

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Vyrian

USA . 4,940 parts In-Stock

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Digiode

USA . 4,924 parts In-Stock

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Anansix

USA . 2,090 parts In-Stock

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Microchip USA

USA . 262 parts In-Stock

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$4.776

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IDEA Electronic Components Group

UK . 793 parts In-Stock

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$10.986

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$9.887

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MKK Technologies

India . 997 parts In-Stock

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$20.658

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DigiPath Technology Company

USA . 997 parts In-Stock

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$20.658

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AZTECH Wire

Italy . 431 parts In-Stock

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$22.170

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QUARKTWIN TECHNOLOGY LTD

USA . 18,729 parts In-Stock

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Vigor

Singapore . 8,193 parts In-Stock

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Kepictronics

USA . 6,668 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 1,890 parts In-Stock

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Parana Technologies

USA . 957 parts In-Stock

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Authorized Procurement Solutions

USA . 497 parts In-Stock

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Overview

Elevate your designs with the STG4159BJR from STMicroelectronics, a leader in high-quality semiconductor solutions. This ultra-thin, reliable multiplexer offers exceptional performance in demanding applications such as industrial control and consumer electronics. With its low on-state resistance and quick switching times, it maximizes efficiency while minimizing power consumption. Trust STMicroelectronics for unparalleled quality and innovative technology that delivers real value to your projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient integration in compact electronic devices, enhancing space optimization.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to a variety of PCB layouts, making it versatile for multiple applications.

Nominal Supply Voltage (Vsup): 1.8 V

Operating at a low nominal supply voltage ensures compatibility with low-power digital circuits, reducing overall energy consumption.

Power Supplies (V): 1.8/4.5

The flexibility in power supply voltage ranges allows for versatility in design, accommodating various system requirements.

No. of Terminals: 7

With 7 terminals, this product offers significant connectivity options, supporting multiple functionalities in a single device.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile grid array design help maximize density and minimize footprints on PCBs, ideal for compact applications.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures makes this component suitable for industrial applications that require reliable performance under heat.

Minimum Operating Temperature: -40 °C

Operational reliability in low temperatures ensures functionality in extreme conditions, perfect for outdoor and harsh environment applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in direct mounting on PCBs, simplifying assembly and reducing overall circuit complexity.

Maximum Seated Height: 0.715 mm

A low seated height allows for more compact designs, making it easier to incorporate into design layouts with height restrictions.

Width: 1.068 mm

A small width contributes to reduced PCB space usage, enabling designers to create more compact and efficient circuits.

Other IC type: SPDT

Single Pole Double Throw functionality provides versatile switching capabilities, essential for various signal routing applications.

Minimum Supply Voltage (Vsup): 1.65 V

The lower limit on supply voltage ensures adaptability to various low-voltage applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

Longer peak reflow time allows for better soldering processes, ensuring reliable connections during assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature tolerance ensures the IC can withstand modern soldering techniques without damage.

Maximum On-state Resistance (Ron): 0.65 ohm

Low on-state resistance minimizes power loss and heat generation, enhancing efficiency during operation.

Maximum Switch-on Time: 123 ns

Fast switch-on time is crucial for high-speed applications, ensuring quick response times and improved overall system performance.

Length: 2.068 mm

Compact length is advantageous for space-constrained designs, allowing for efficient use of available board real estate.

Maximum Switch-off Time: 15 ns

Rapid switch-off capability is beneficial in high-frequency applications, supporting fast signal processing and integrity.

Temperature Grade: INDUSTRIAL

Industrial temperature grading signifies reliability and durability in challenging operating environments, ensuring long-term performance.

Technology: CMOS

CMOS technology supports low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and electrical connections, improving overall performance.

Terminal Pitch: 0.5 mm

A tighter terminal pitch allows for increased functionality in smaller footprints, facilitating innovations in miniaturized devices.

Maximum Supply Voltage (Vsup): 4.8 V

The upper supply voltage limit presents flexibility in application designs requiring higher voltages for different functions.

Nominal Off-state Isolation: 69 dB

High nominal off-state isolation minimizes crosstalk and ensures signal integrity, critical for reliable data transmission.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching mechanism prevents short circuits, ensuring safe operation in various applications.

Nominal On-state Resistance Match: 0.005 ohm

Exceptional matching in on-state resistance contributes to minimal signal loss and enhanced performance in multiplexing applications.

Technical Specifications

Multiplexers & Switches STG4159BJR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-XBGA-B7

Length:

2.068 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

7

Nominal Off-state Isolation:

69 dB

Nominal On-state Resistance Match:

.005 ohm

Maximum On-state Resistance (Ron):

.65 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/4.5

Qualification:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

15 ns

Maximum Switch-on Time:

123 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.068 mm

Trade Compliance

STG4159BJR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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