Loading...

STG4159

STMicroelectronics

STG4159 by STMicroelectronics

STG4159 by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 0.65Ω and operates b/w 1.65V to 4.8V. It features a very thin profile (0.715mm) and offers high isolation (69dB). Ideal for industrial applications requiring compact, efficient switching solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,625

-

-

-

-

Anansix

USA . 2,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,185

-

-

-

-

Vyrian

USA . 1,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,576

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$21.454

100+ parts

-

1k+ parts

$19.309

10k+ parts

-

2,269

$21.454

-

$19.309

-

MKK Technologies

India . 195 parts In-Stock

1+ parts

$40.344

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$40.344

-

-

-

DigiPath Technology Company

USA . 195 parts In-Stock

1+ parts

$40.344

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$40.344

-

-

-

Corphita

USA . 4,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,153

-

-

-

-

Parana Technologies

USA . 303 parts In-Stock

1+ parts

-

100+ parts

$25.652

1k+ parts

-

10k+ parts

-

303

-

$25.652

-

-

Overview

Elevate your designs with the STG4159 from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile SPDT switch delivers exceptional performance across various applications, ensuring reliable signal integrity and minimal power loss. With its ultra-compact form and robust temperature range, the STG4159 is perfect for space-constrained environments and industrial use. Experience quality, efficiency, and unmatched value that only STMicroelectronics can provide.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization and is ideal for automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape is designed for optimal PCB layout, ensuring compatibility with various circuit designs.

Nominal Supply Voltage (Vsup): 1.8 V

A nominal supply voltage of 1.8 V is suitable for low-power applications, enhancing energy efficiency.

Power Supplies (V): 1.8/4.5 V

Dual supply voltage options provide flexibility for a wide range of applications and designs.

No. of Terminals: 7

Having 7 terminals allows for versatile connectivity and integration into various circuit configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style facilitates high-density PCB designs, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for harsh environmental conditions.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient heat dissipation and optimal performance on the PCB.

Maximum Seated Height: 0.715 mm

A low seated height allows for a thinner profile, beneficial for space-critical applications.

Width: 1.068 mm

The compact width contributes to space-saving designs in modern electronic applications.

Other IC type: SPDT

The SPDT configuration provides flexibility in signal routing, making this component versatile for various designs.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage enhances compatibility with battery-powered devices, increasing efficiency.

Maximum On-state Resistance (Ron): 0.65 ohm

Low on-state resistance reduces power loss during operation, improving overall device efficiency.

Maximum Switch-on Time: 123 ns

Fast switch-on time ensures quick signal response, making it suitable for high-speed applications.

Length: 2.068 mm

The small length makes it an excellent fit for compact designs, contributing to overall space efficiency.

Maximum Switch-off Time: 15 ns

Ultra-fast switch-off time enhances performance in time-sensitive applications and reduces signal interference.

Temperature Grade: INDUSTRIAL

Industrial temperature rating ensures durability and reliable performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it ideal for modern electronic circuits.

Terminal Form: BALL

Ball terminal form enhances mechanical stability and soldering reliability on the PCB.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density connections, which is crucial for advanced electronic designs.

Maximum Supply Voltage (Vsup): 4.8 V

High maximum supply voltage offers versatility for various applications, catering to different power requirements.

Nominal Off-state Isolation: 69 dB

High off-state isolation minimizes signal cross-talk, improving signal integrity in multi-channel systems.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching technique prevents short circuits, enhancing the reliability of the circuit design.

Nominal On-state Resistance Match: 0.005 ohm

Excellent on-state resistance match allows for consistent performance across multiple channels, improving overall system efficiency.

Technical Specifications

Multiplexers & Switches STG4159 attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-XBGA-B7

Length:

2.068 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

7

Nominal Off-state Isolation:

69 dB

Nominal On-state Resistance Match:

.005 ohm

Maximum On-state Resistance (Ron):

.65 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/4.5

Qualification:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

15 ns

Maximum Switch-on Time:

123 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.068 mm

Trade Compliance

STG4159 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7