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STF6NK70Z

STMicroelectronics

STF6NK70Z by STMicroelectronics

STF6NK70Z by STMicroelectronics is a robust N-channel FET designed for switching applications. It features a 700V breakdown voltage, 20A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,123 parts In-Stock

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4,123

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Digiode

USA . 834 parts In-Stock

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834

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Anansix

USA . 111 parts In-Stock

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111

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 115 parts In-Stock

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$1.591

100+ parts

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$1.432

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115

$1.591

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$1.432

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MKK Technologies

India . 1,840 parts In-Stock

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$2.991

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1,840

$2.991

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DigiPath Technology Company

USA . 1,840 parts In-Stock

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$2.991

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1,840

$2.991

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AZTECH Wire

Italy . 950 parts In-Stock

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$18.970

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950

$18.970

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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20,000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,109 parts In-Stock

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Corphita

USA . 4,990 parts In-Stock

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4,990

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Alle Elektronik GmbH

Germany . 4,959 parts In-Stock

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4,959

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Parana Technologies

USA . 1,576 parts In-Stock

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$1.902

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1,576

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$1.902

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Overview

Unlock exceptional performance with the STF6NK70Z from STMicroelectronics, a leading name in semiconductor innovation. This powerful N-channel FET is designed for reliable switching applications, ensuring efficiency and durability in your projects. With its robust construction and high breakdown voltage, it excels in demanding environments, delivering unmatched value and reliability. Choose STF6NK70Z to elevate your designs with confidence and resilience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable plastic/epoxy material ensures robust packaging, making the product suitable for various electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and better performance in switching applications, making them ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and functionality, ensuring reliable operation in diverse circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and high reliability for control circuits.

Minimum DS Breakdown Voltage: 700 V

A high breakdown voltage makes this FET suitable for high-voltage applications, enhancing system safety and performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization in circuit designs, facilitating easier integration into various layouts.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support and is ideal for applications requiring strong connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables low-power consumption in the off-state, making it energy efficient for circuit designs.

Maximum Pulsed Drain Current (IDM): 20 A

A high pulsed current rating allows this FET to handle short bursts of power, making it suitable for various transient applications.

Avalanche Energy Rating (EAS): 200 mJ

The high avalanche energy rating indicates excellent robustness against voltage spikes, prolonging device life and reliability.

Maximum Drain Current (Abs) (ID): 5 A

Capable of handling up to 5 A, this FET is versatile for a wide range of applications requiring reliable current management.

No. of Terminals: 3

With three terminals, the design simplifies connections and enhances the flexibility for different circuit configurations.

Maximum Power Dissipation (Abs): 30 W

A high power dissipation capability allows for effective heat management, increasing reliability in power-intensive applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure installation and stability, making it suitable for demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology facilitates higher efficiency and faster switching speeds, contributing to overall improved performance.

Maximum Operating Temperature: 150 °C

A high operating temperature rating indicates resilience in extreme environments, ensuring reliable performance in challenging conditions.

Transistor Element Material: SILICON

Silicon material ensures good thermal conductivity and stability, making it a reliable choice for power applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and improves corrosion resistance, ensuring long-lasting durability.

Maximum Drain Current (ID): 5 A

Reinforcing its versatility, the ability to handle up to 5 A current allows use in a variety of power management scenarios.

Maximum Drain-Source On Resistance: 1.8 ohm

Low on-resistance ensures minimal energy loss during operation, contributing to overall system efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout, making it easier to integrate into various applications.

Case Connection: ISOLATED

An isolated case connection increases safety by preventing unintended electrical contact, enhancing user safety in applications.

Technical Specifications

Power Field Effect Transistors (FET) STF6NK70Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

1.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF6NK70Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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