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STF6NM60N

STMicroelectronics

STF6NM60N by STMicroelectronics

STF6NM60N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and 4.6A max drain current. It operates in enhancement mode with a low on-resistance of 0.92Ω. This versatile FET is suitable for various power management tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,599 parts In-Stock

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6,599

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Digiode

USA . 2,858 parts In-Stock

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2,858

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Anansix

USA . 1,591 parts In-Stock

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1,591

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

1+ parts

$0.424

100+ parts

-

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$0.382

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1,181

$0.424

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$0.382

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MKK Technologies

India . 185 parts In-Stock

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$0.798

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185

$0.798

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DigiPath Technology Company

USA . 185 parts In-Stock

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$0.798

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185

$0.798

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AZTECH Wire

Italy . 329 parts In-Stock

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$16.300

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329

$16.300

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 27,274 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,980 parts In-Stock

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4,980

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Alle Elektronik GmbH

Germany . 3,513 parts In-Stock

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3,513

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Corphita

USA . 2,713 parts In-Stock

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2,713

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Parana Technologies

USA . 972 parts In-Stock

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$0.507

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972

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$0.507

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Kepictronics

USA . 700 parts In-Stock

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700

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Overview

Unlock unparalleled performance with the STF6NM60N from STMicroelectronics! This top-tier N-channel Power FET delivers exceptional efficiency and reliability, making it perfect for demanding switching applications. With STMicroelectronics' renowned commitment to quality and innovation, you can trust that this component will elevate your designs while reducing energy consumption. Experience enhanced durability and exceptional value that translates into tangible benefits for your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient for higher current applications, making this product suitable for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves reliability by providing inherent protection against reverse voltage.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for efficient control of power in electronic circuits, making it versatile for many uses.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this product can safely operate in high-voltage applications, providing enhanced safety and reliability.

Package Shape: RECTANGULAR

The rectangular package shape facilitates convenient mounting and connection options in various circuit designs.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers strong mechanical durability and is favored in applications requiring robust connections.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows the transistor to conduct only when a particular gate-to-source voltage is applied, improving control in switching applications.

Maximum Pulsed Drain Current (IDM): 18.4 A

High pulsed drain current capability makes this product suitable for applications requiring short bursts of high current.

Avalanche Energy Rating (EAS): 65 mJ

A solid avalanche energy rating indicates robustness to handle transient conditions, further enhancing reliability in various applications.

Maximum Drain Current (Abs) (ID): 4.6 A

With a maximum drain current of 4.6 A, this FET can handle significant power loads, making it ideal for a range of applications.

No. of Terminals: 3

Having three terminals allows for versatile circuit configurations and simplified connection in designs.

Maximum Power Dissipation (Abs): 20 W

The product's ability to dissipate up to 20 W of power underscores its effectiveness in handling thermal loads efficiently.

Package Style (Meter): FLANGE MOUNT

Flange mount design eases integration into systems while providing robust mechanical stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high-speed operation, making this product suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the FET to function reliably in demanding environments without degradation.

Transistor Element Material: SILICON

Silicon is a standard material that provides a good balance of performance and cost, ensuring this FET is widely applicable.

Terminal Finish: TIN

Tin terminal finish enhances solderability and protects against oxidation, ensuring reliable connections in circuits.

Maximum Drain Current (ID): 4.6 A

This repeated spec reaffirms the efficiency of the FET in managing moderate current loads efficiently.

Maximum Drain-Source On Resistance: 0.92 ohm

A low on-resistance value leads to decreased power losses and improved energy efficiency during operation.

Terminal Position: SINGLE

Single terminal positioning simplifies design requirements and aids in ease of integration into various systems.

Case Connection: ISOLATED

Isolated case connection improves safety by reducing the risk of unintended circuit paths that could lead to failures.

Technical Specifications

Power Field Effect Transistors (FET) STF6NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

4.6 A

Maximum Drain Current (ID):

4.6 A

Maximum Drain-Source On Resistance:

.92 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF6NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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