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STF6NK50Z

STMicroelectronics

STF6NK50Z by STMicroelectronics

STF6NK50Z by STMicroelectronics is a robust N-channel FET designed for switching applications, featuring a 500V breakdown voltage and 22.4A pulsed drain current. It operates in enhancement mode with a max power dissipation of 25W. Ideal for high-temperature environments up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,989 parts In-Stock

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3,989

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Digiode

USA . 2,189 parts In-Stock

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2,189

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Anansix

USA . 203 parts In-Stock

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203

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,152 parts In-Stock

1+ parts

$0.905

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$0.815

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1,152

$0.905

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$0.815

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MKK Technologies

India . 1,139 parts In-Stock

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$1.702

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$1.702

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DigiPath Technology Company

USA . 1,139 parts In-Stock

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$1.702

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1,139

$1.702

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 1,545 parts In-Stock

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Parana Technologies

USA . 309 parts In-Stock

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$1.082

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$1.082

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Overview

Elevate your designs with the STF6NK50Z from STMicroelectronics, a powerhouse in Power FET technology. Renowned for excellence, STMicroelectronics delivers unmatched reliability and performance. This N-channel transistor offers robust switching capabilities with an impressive breakdown voltage of 500V, making it ideal for industrial applications, power supplies, and automotive systems. Experience enhanced efficiency and durability—choose a trusted partner for your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures lightweight construction and good moisture protection, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the FET from reverse currents, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and high efficiency in power management.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage supports operation in high-voltage environments, allowing it to handle demanding electrical conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and reliable electrical connections, suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to higher efficiency and lower power loss during switching, making this FET an excellent choice for modern electronic applications.

Maximum Pulsed Drain Current (IDM): 22.4 A

Capable of handling significant pulse currents, this FET is suitable for applications requiring high transient load handling.

Avalanche Energy Rating (EAS): 180 mJ

This feature allows the FET to safely dissipate energy from transients, enhancing reliability in unpredictable electrical environments.

Maximum Drain Current (Abs) (ID): 5.6 A

The 5.6 A limit makes this FET suitable for a variety of medium-power applications while ensuring safe operation within specified conditions.

No. of Terminals: 3

Three terminals simplify circuit design and integration, making it user-friendly for engineers.

Maximum Power Dissipation (Abs): 25 W

A maximum power dissipation of 25 W allows for effective heat management, ensuring stable performance under high load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides stable mounting options for secure integration into larger systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high-speed operation and low power consumption, essential for energy-efficient designs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can perform reliably in demanding thermal environments.

Transistor Element Material: SILICON

Silicon-based construction is the standard for reliable performance, ensuring durability and efficiency in operation.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability, ensuring reliable connections during assembly processes.

Maximum Drain Current (ID): 5.6 A

The defined 5.6 A limit ensures versatility for various applications while maintaining device integrity.

Maximum Drain-Source On Resistance: 1.2 ohm

A low on-resistance minimizes power losses during operation, increasing overall system efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies design layout, allowing for easier PCB design and assembly.

Case Connection: ISOLATED

An isolated case connection enhances safety and prevents unwanted interactions with surrounding components.

Technical Specifications

Power Field Effect Transistors (FET) STF6NK50Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5.6 A

Maximum Drain Current (ID):

5.6 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF6NK50Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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