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STF6N62K3-H

STMicroelectronics

STF6N62K3-H by STMicroelectronics

STF6N62K3-H by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 620V breakdown voltage and a max drain current of 5.5A. It operates in enhancement mode with a power dissipation of 25W. Ideal for high-voltage circuits, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,359 parts In-Stock

1+ parts

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4,359

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Anansix

USA . 1,697 parts In-Stock

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1,697

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Digiode

USA . 723 parts In-Stock

1+ parts

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723

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,370 parts In-Stock

1+ parts

$0.335

100+ parts

-

1k+ parts

$0.301

10k+ parts

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1,370

$0.335

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$0.301

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MKK Technologies

India . 409 parts In-Stock

1+ parts

$0.630

100+ parts

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409

$0.630

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DigiPath Technology Company

USA . 409 parts In-Stock

1+ parts

$0.630

100+ parts

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409

$0.630

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Corphita

USA . 730 parts In-Stock

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730

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Parana Technologies

USA . 580 parts In-Stock

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$0.400

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580

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$0.400

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Overview

Unlock unparalleled performance with the STF6N62K3-H from STMicroelectronics, a leader in cutting-edge semiconductor technology. This N-channel power FET excels in switching applications, offering robust reliability and efficiency for your projects. Engineered for resilience, it withstands high voltages and temperature extremes, ensuring seamless operation. Elevate your designs with unmatched quality and enjoy the peace of mind that comes from partnering with a trusted manufacturer renowned for innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY ensures durability and reliability, making it suitable for various applications in harsh environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors provide higher efficiency and better performance in switching applications compared to P-Channel, making this FET ideal for a variety of power management solutions.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature enhances the FET's protection against reverse currents, providing additional reliability in circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching, this FET enables efficient control of power in electronic circuits, making it a versatile choice for various power applications.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage of 620V, this FET can safely handle high-voltage applications, ensuring durability and reducing the risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs, making it easier to design compact electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and are easy to solder, making the FET easy to integrate into various designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high input impedance and improved switching performance, making this FET suitable for low-power applications.

Maximum Pulsed Drain Current (IDM): 22 A

A high maximum pulsed drain current of 22A allows the FET to handle significant current surges, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 140 mJ

The avalanche energy rating indicates robust protection against over-voltage conditions, ensuring reliability in dynamic applications.

Maximum Drain Current (Abs) (ID): 5.5 A

With a maximum drain current rating of 5.5A, this FET is suitable for various applications while providing safety margins against overload.

No. of Terminals: 3

The 3-terminal design simplifies circuit integration and connectivity, allowing for efficient layout on printed circuit boards.

Maximum Power Dissipation (Abs): 25 W

A power dissipation capability of 25W ensures that the FET can operate effectively under load without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount packages offer secure mounting options, enhancing thermal management and stability in high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides low on-resistance and high-speed switching capabilities, making this component suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C permits the FET to function in demanding thermal environments, reducing the need for extensive cooling solutions.

Transistor Element Material: SILICON

Silicon material ensures effective conduction with well-understood properties in various power applications, making this FET both reliable and efficient.

Terminal Finish: MATTE TIN

A matte tin finish provides excellent solderability and corrosion resistance, ensuring high-quality connections in electronic assemblies.

Maximum Drain-Source On Resistance: 1.28 ohm

With low on-resistance, this FET minimizes power loss during operation, increasing overall system efficiency in power applications.

Terminal Position: SINGLE

A single terminal position ensures straightforward installation and integration into diverse electronic circuits.

Case Connection: ISOLATED

An isolated case connection prevents unintended current paths and enhances safety in circuit operation, making this FET ideal for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF6N62K3-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

1.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF6N62K3-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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