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STF6N62K3

STMicroelectronics

STF6N62K3 by STMicroelectronics

STF6N62K3 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 620V breakdown voltage, 22A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$1.090

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 434 parts In-Stock

1+ parts

$1.090

100+ parts

-

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434

$1.090

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Mouser Electronics

USA . 1,671 parts In-Stock

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$2.550

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1,671

$2.550

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DigiKey

USA . 597 parts In-Stock

1+ parts

$2.820

100+ parts

$1.258

1k+ parts

$0.937

10k+ parts

$0.844

597

$2.820

$1.258

$0.937

$0.844

Avnet

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

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Arrow

USA . 2,000 parts In-Stock

1+ parts

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$0.790

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2,000

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$0.790

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Verical

USA . 2,000 parts In-Stock

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$0.787

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2,000

-

-

$0.787

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EBV Elektronik

Germany . 2,000 parts In-Stock

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2,000

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Distributors (In-Stock)

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Digiode

USA . 3,506 parts In-Stock

1+ parts

$0.775

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3,506

$0.775

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Vyrian

USA . 2,267 parts In-Stock

1+ parts

$0.786

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2,267

$0.786

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Classic Components Corporation

USA . 10,500 parts In-Stock

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10,500

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Chip Stock

USA . 8,765 parts In-Stock

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8,765

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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Anansix

USA . 1,668 parts In-Stock

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1,668

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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HZD GmbH

Germany . 680 parts In-Stock

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680

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Pegasus Components GmbH

Germany . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 10,753 parts In-Stock

1+ parts

$0.670

100+ parts

$0.670

1k+ parts

$0.860

10k+ parts

-

10,753

$0.670

$0.670

$0.860

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Ampacity Inc.

Singapore . 712 parts In-Stock

1+ parts

$0.670

100+ parts

-

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712

$0.670

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Corphita

USA . 1,415 parts In-Stock

1+ parts

$0.734

100+ parts

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1,415

$0.734

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

1+ parts

$1.114

100+ parts

-

1k+ parts

$1.003

10k+ parts

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1,678

$1.114

-

$1.003

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MKK Technologies

India . 1,832 parts In-Stock

1+ parts

$2.095

100+ parts

-

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1,832

$2.095

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DigiPath Technology Company

USA . 1,832 parts In-Stock

1+ parts

$2.095

100+ parts

-

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1,832

$2.095

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Microchip USA

USA . 3,825 parts In-Stock

1+ parts

$14.300

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3,825

$14.300

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Infinite Electronics LLP (Excess)

. 85,436 parts In-Stock

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85,436

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Formix International (Excess)

India . 42,715 parts In-Stock

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42,715

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Kepictronics

USA . 29,110 parts In-Stock

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Perfect Parts

USA . 6,018 parts In-Stock

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6,018

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Epart123

USA . 5,950 parts In-Stock

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$0.300

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$0.300

5,950

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$0.300

$0.300

S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 2,950 parts In-Stock

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2,950

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A-Z Elektronik GmbH

Germany . 1,764 parts In-Stock

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1,764

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Parana Technologies

USA . 357 parts In-Stock

1+ parts

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100+ parts

$1.332

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357

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$1.332

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Cyclops Electronics Ltd (Excess)

UK . 70 parts In-Stock

1+ parts

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70

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Overview

Unlock your project’s potential with the STF6N62K3 from STMicroelectronics, a leader in power semiconductor solutions. This robust N-channel FET is designed for superior switching performance, ensuring efficiency and reliability in demanding applications. With a remarkable voltage rating and built-in diode, it enhances system durability while simplifying your design process. Choose STF6N62K3 for quality you can trust and elevate your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and provides effective insulation, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer improved electron mobility, leading to higher efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and simplifies circuit design by integrating essential features into a single package.

Transistor Application: SWITCHING

Designed specifically for switching applications, it guarantees fast operation and reliable performance in electronic circuits.

Minimum DS Breakdown Voltage: 620 V

A high breakdown voltage ensures reliability in high-voltage applications, protecting the transistor from damage during operation.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on circuit boards, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and excellent connectivity, making it easy to handle during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control over conductivity, leading to lower power losses and improved efficiency.

Maximum Pulsed Drain Current (IDM): 22 A

The ability to handle high pulsed currents provides versatility in applications requiring brief, high-power pulses.

Avalanche Energy Rating (EAS): 140 mJ

A high avalanche energy rating indicates resilience against transient voltage spikes, enhancing the reliability in harsh environments.

Maximum Drain Current (Abs) (ID): 5.5 A

With a maximum drain current of 5.5 A, it supports moderate power applications without risk of overheating.

No. of Terminals: 3

Three terminals offer a straightforward configuration for connection in various circuit layouts while maintaining ease of use.

Maximum Power Dissipation (Abs): 25 W

A maximum power dissipation of 25 W signifies effective thermal management, enhancing the component's reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure attachment and greater thermal dissipation, optimizing performance in assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high switching speeds and low on-resistance, making this FET ideal for efficient power management.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature guarantees consistent performance even in extreme thermal environments.

Transistor Element Material: SILICON

Silicon as the element material enhances performance characteristics and economic viability for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin offers good solderability and corrosion resistance, ensuring reliability and longevity in connections.

Maximum Drain Current (ID): 5.5 A

Repeating maximum drain current (ID) reinforces its capability to conduct adequate current levels without failure.

Maximum Drain-Source On Resistance: 1.2 ohm

A low on-resistance minimizes power loss during operation, leading to improved efficiency and thermal performance.

Terminal Position: SINGLE

A single terminal position simplifies layout and design, facilitating straightforward integration into diverse circuit configurations.

Case Connection: ISOLATED

An isolated case connection minimizes the risk of electrical shorts, enhancing safety and reliability in various applications.

Technical Specifications

Power Field Effect Transistors (FET) STF6N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA LOW-ON RESISTANCE

Avalanche Energy Rating (EAS):

140 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF6N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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