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STF40N20

STMicroelectronics

STF40N20 by STMicroelectronics

STF40N20 by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain current of 40 A, a breakdown voltage of 200 V, and operates at up to 150 °C. Its compact design ensures efficient performance in power management systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,060 parts In-Stock

1+ parts

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4,060

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Vyrian

USA . 2,635 parts In-Stock

1+ parts

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2,635

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Anansix

USA . 395 parts In-Stock

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395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,339 parts In-Stock

1+ parts

$1.373

100+ parts

-

1k+ parts

$1.235

10k+ parts

-

2,339

$1.373

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$1.235

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MKK Technologies

India . 423 parts In-Stock

1+ parts

$2.581

100+ parts

-

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423

$2.581

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DigiPath Technology Company

USA . 423 parts In-Stock

1+ parts

$2.581

100+ parts

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10k+ parts

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423

$2.581

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AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$16.430

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332

$16.430

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Alle Elektronik GmbH

Germany . 3,459 parts In-Stock

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3,459

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Corphita

USA . 2,334 parts In-Stock

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2,334

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Parana Technologies

USA . 1,595 parts In-Stock

1+ parts

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100+ parts

$1.641

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1,595

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$1.641

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the STF40N20 from STMicroelectronics, a leader in high-performance semiconductor solutions. This robust N-channel power FET excels in switching applications, delivering unparalleled efficiency and reliability. With its compact design and advanced features, it’s ideal for various industries, from automotive to industrial automation. Choose STF40N20 for superior quality and performance, ensuring your projects thrive in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material offers durability and resistance to environmental factors, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better efficiency and faster switching speeds, which makes this product ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against voltage spikes and improves overall circuit reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on/off transitions, making it suitable for power management and amplifying signals.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this FET can operate safely in high-voltage environments, adding versatility for various circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and facilitates easy integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and ease of soldering, making assembly straightforward.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows this FET to provide superior performance in power applications, contributing to improved efficiency.

Maximum Pulsed Drain Current (IDM): 160 A

The ability to handle high pulsed drain currents makes this FET suitable for applications requiring brief bursts of high power.

Avalanche Energy Rating (EAS): 230 mJ

A high avalanche energy rating contributes to the robustness of this FET, making it resilient to transient events.

Maximum Drain Current (Abs) (ID): 40 A

The high maximum drain current capacity allows for efficient power delivery in demanding applications.

No. of Terminals: 3

The three-terminal design simplifies circuit designs and offers flexibility in connection configurations.

Maximum Power Dissipation (Abs): 40 W

The ability to dissipate 40 W of power indicates that this FET can handle significant power loads, ensuring reliable operation in high-power scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount provides additional stability and heat dissipation capabilities, making it suitable for industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and improved thermal stability, enhancing the overall performance of the device.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures increases the product's reliability in extreme conditions.

Transistor Element Material: SILICON

Silicon as a semiconductor material is widely used and respected for its performance, stability, and cost-effectiveness in electronics.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and long-term reliability, ensuring stable connections over time.

Maximum Drain Current (ID): 40 A

Reiterating the maximum drain current capacity emphasizes the product's capability for high-current applications.

Maximum Drain-Source On Resistance: 0.045 ohm

Low on-resistance translates to improved efficiency and reduced heat generation during operation, enhancing performance.

Terminal Position: SINGLE

A single terminal position simplifies the PCB layout design, aiding in efficient circuit design.

Case Connection: ISOLATED

Isolated case connection helps to enhance safety by reducing the risk of short circuits and ensuring proper function in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF40N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF40N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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