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STF4N52K3

STMicroelectronics

STF4N52K3 by STMicroelectronics

STF4N52K3 by STMicroelectronics is a N-CHANNEL FET with 525V DS Breakdown Voltage, ideal for SWITCHING applications. It features 10A Max Pulsed Drain Current and 2.6 ohm Max Drain-Source On Resistance, operating in ENHANCEMENT MODE at up to 150 °C.

Median Price

$1.710

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,834 parts In-Stock

1+ parts

$1.710

100+ parts

$0.728

1k+ parts

$0.525

10k+ parts

-

1,834

$1.710

$0.728

$0.525

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 200 parts In-Stock

1+ parts

$1.624

100+ parts

-

1k+ parts

-

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200

$1.624

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-

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Vyrian

USA . 1,052 parts In-Stock

1+ parts

$1.710

100+ parts

-

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1,052

$1.710

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Anansix

USA . 2,162 parts In-Stock

1+ parts

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2,162

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R&J Components

USA . 1,700 parts In-Stock

1+ parts

-

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1,700

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Bristol Electronics

USA . 105 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$0.900

10k+ parts

-

105

-

$1.500

$0.900

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Dan-Mar Components

USA . 105 parts In-Stock

1+ parts

-

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105

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$1.093

100+ parts

$0.995

1k+ parts

$0.896

10k+ parts

-

70

$1.093

$0.995

$0.896

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IDEA Electronic Components Group

UK . 514 parts In-Stock

1+ parts

$1.419

100+ parts

-

1k+ parts

$1.277

10k+ parts

-

514

$1.419

-

$1.277

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Corphita

USA . 4,529 parts In-Stock

1+ parts

$1.539

100+ parts

-

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4,529

$1.539

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MKK Technologies

India . 1,778 parts In-Stock

1+ parts

$2.668

100+ parts

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1,778

$2.668

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DigiPath Technology Company

USA . 1,778 parts In-Stock

1+ parts

$2.668

100+ parts

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1k+ parts

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10k+ parts

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1,778

$2.668

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-

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Microchip USA

USA . 282 parts In-Stock

1+ parts

$7.280

100+ parts

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282

$7.280

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Component Stockers USA

USA . 237 parts In-Stock

1+ parts

$99.990

100+ parts

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237

$99.990

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Perfect Parts

USA . 3,764 parts In-Stock

1+ parts

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3,764

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Alle Elektronik GmbH

Germany . 1,834 parts In-Stock

1+ parts

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1,834

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Parana Technologies

USA . 1,506 parts In-Stock

1+ parts

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100+ parts

$1.696

1k+ parts

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1,506

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$1.696

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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Overview

Unleash the power of innovation with the STF4N52K3 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors (FET) that are perfect for a wide range of switching applications. With a maximum pulsed drain current of 10A and an avalanche energy rating of 110mJ, this N-channel transistor offers exceptional performance and reliability. Whether you're looking to optimize your power management system or enhance your electronic devices, the STF4N52K3 provides the value, benefits, and advantages you need to stay ahead of the curve. Choose STMicroelectronics for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the FET, ensuring longevity and protection against external elements.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility and lower on-resistance, making them efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for efficient energy dissipation, protection against reverse current, and simplifies circuit design.

Transistor Application: SWITCHING

Ideal for switching applications due to fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 525 V

High breakdown voltage allows for use in high voltage applications, ensuring reliability and safety.

Surface Mount: YES

Allows for easy and compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Pulsed Drain Current (IDM): 10 A

Ability to handle high current pulses ensures reliability and robust performance in demanding conditions.

Maximum Power Dissipation (Abs): 45 W

High power dissipation capability allows for handling large power loads without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures reliability in extreme temperature conditions.

Maximum Drain-Source On Resistance: 2.6 ohm

Low on-resistance results in minimal power loss and efficient operation of the FET.

Technical Specifications

Power Field Effect Transistors (FET) STF4N52K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

110 mJ

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

2.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF4N52K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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