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STF4NK50ZD

STMicroelectronics

STF4NK50ZD by STMicroelectronics

STF4NK50ZD by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and a max drain current of 3A. It operates in enhancement mode with a power dissipation of up to 20W. This versatile transistor is suitable for various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,226 parts In-Stock

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Anansix

USA . 745 parts In-Stock

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745

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Digiode

USA . 654 parts In-Stock

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654

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IDEA Electronic Components Group

UK . 2,364 parts In-Stock

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$0.461

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$0.415

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2,364

$0.461

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MKK Technologies

India . 1,023 parts In-Stock

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$0.867

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$0.867

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DigiPath Technology Company

USA . 1,023 parts In-Stock

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$0.867

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$0.867

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AZTECH Wire

Italy . 986 parts In-Stock

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$12.500

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986

$12.500

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Component Stockers USA

USA . 423 parts In-Stock

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$99.990

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423

$99.990

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Alle Elektronik GmbH

Germany . 3,456 parts In-Stock

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Corphita

USA . 2,094 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,063 parts In-Stock

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$0.551

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Overview

Unlock superior performance with the STF4NK50ZD from STMicroelectronics, a powerhouse in the realm of Power FETs. Renowned for their reliability and innovation, STMicroelectronics delivers a product designed for efficient switching in demanding applications. With its robust 500V breakdown voltage and built-in diode, this N-channel transistor ensures seamless operation and enhanced durability. Elevate your projects with unmatched quality and experience the benefits of dependable power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, making it suitable for various applications while ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and better efficiency in switching applications, making them ideal for high-performance circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing protection against reverse voltage, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET can handle rapid on/off cycles, making it perfect for modern electronic devices.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage ensures that this FET can operate safely in high-voltage applications, reducing the risk of failures.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and ease of soldering, ideal for applications requiring strong connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and higher efficiency, crucial for battery-operated devices.

Maximum Pulsed Drain Current (IDM): 12 A

This high pulsed drain current rating allows the FET to handle brief surges of current, making it suitable for dynamic loads.

Avalanche Energy Rating (EAS): 120 mJ

A substantial avalanche energy rating indicates robust performance in transient conditions, enhancing reliability in demanding applications.

Maximum Drain Current (Abs) (ID): 3 A

With a maximum drain current of 3 A, this FET is versatile for a wide range of switching applications without exceeding current limits.

No. of Terminals: 3

The three-terminal design simplifies circuit connections, enabling easy integration into various electronic designs.

Maximum Power Dissipation (Abs): 20 W

A maximum power dissipation of 20 W ensures this FET can handle significant power loads, supporting a range of high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount allows for secure installation in various environments, improving thermal management and stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low output capacitance, translating to faster switching speeds and efficiency in operation.

Maximum Operating Temperature: 150 °C

Operating at high temperatures up to 150 °C enhances durability and performance in harsh environments.

Transistor Element Material: SILICON

Silicon ensures high reliability and performance in various electrical conditions, making it a standard choice in semiconductor applications.

Terminal Finish: TIN

The tin terminal finish promotes better solderability and corrosion resistance, leading to longer-lasting connections.

Maximum Drain Current (ID): 3 A

Consistent with earlier specs, the FET's ability to handle 3 A makes it ideal for numerous applications without the risk of overload.

Maximum Drain-Source On Resistance: 2.7 ohm

A low on-resistance value translates into lower power losses during operation, enhancing overall energy efficiency.

Terminal Position: SINGLE

A single terminal position reduces design complexity, allowing for straightforward circuit integration.

Case Connection: ISOLATED

Isolated case connections enhance safety and reduce noise interference, crucial for sensitive electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STF4NK50ZD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF4NK50ZD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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