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STF33N65M2

STMicroelectronics

STF33N65M2 by STMicroelectronics

STF33N65M2 from STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 650V breakdown voltage and a max drain current of 24A. It operates in enhancement mode with a low on-resistance of 0.14Ω. This versatile FET is suitable for high-efficiency power management systems.

Median Price

$2.400

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

$2.250

100+ parts

$1.750

1k+ parts

$1.610

10k+ parts

$1.590

3,000

$2.250

$1.750

$1.610

$1.590

Mouser Electronics

USA . 999 parts In-Stock

1+ parts

$4.490

100+ parts

$1.900

1k+ parts

$1.810

10k+ parts

-

999

$4.490

$1.900

$1.810

-

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$2.450

1k+ parts

$2.075

10k+ parts

$2.025

3,000

-

$2.450

$2.075

$2.025

Avnet

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

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-

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350

-

-

-

-

Future Electronics

Canada . 35 parts In-Stock

1+ parts

-

100+ parts

$2.350

1k+ parts

$2.290

10k+ parts

$2.230

35

-

$2.350

$2.290

$2.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,660 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

2,660

$1.910

-

-

-

Vyrian

USA . 3,215 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

3,215

$2.010

-

-

-

TME

Poland . 29 parts In-Stock

1+ parts

$3.340

100+ parts

$2.380

1k+ parts

$2.220

10k+ parts

-

29

$3.340

$2.380

$2.220

-

Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

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Anansix

USA . 181 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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181

-

-

-

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Bristol Electronics

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

-

10k+ parts

-

70

-

$1.400

-

-

Microfarads

USA . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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67

-

-

-

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IBS Electronics

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$2.379

1k+ parts

$2.314

10k+ parts

$2.262

35

-

$2.379

$2.314

$2.262

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,072 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,072

$1.710

-

-

-

IDEA Electronic Components Group

UK . 2,300 parts In-Stock

1+ parts

$1.805

100+ parts

-

1k+ parts

$1.625

10k+ parts

-

2,300

$1.805

-

$1.625

-

Corphita

USA . 4,471 parts In-Stock

1+ parts

$1.809

100+ parts

-

1k+ parts

-

10k+ parts

-

4,471

$1.809

-

-

-

MKK Technologies

India . 545 parts In-Stock

1+ parts

$3.394

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$3.394

-

-

-

DigiPath Technology Company

USA . 545 parts In-Stock

1+ parts

$3.394

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$3.394

-

-

-

Microchip USA

USA . 5,200 parts In-Stock

1+ parts

$27.625

100+ parts

-

1k+ parts

-

10k+ parts

-

5,200

$27.625

-

-

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Epart123

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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7,000

-

-

-

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A-Z Elektronik GmbH

Germany . 6,515 parts In-Stock

1+ parts

-

100+ parts

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6,515

-

-

-

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RC Electronics

USA . 5,210 parts In-Stock

1+ parts

-

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5,210

-

-

-

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GreenTree Electronics

Israel . 4,000 parts In-Stock

1+ parts

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4,000

-

-

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Authorized Procurement Solutions

USA . 450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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450

-

-

-

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Eastek

USA . 450 parts In-Stock

1+ parts

-

100+ parts

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450

-

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Infinite Electronics LLP (Excess)

. 413 parts In-Stock

1+ parts

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100+ parts

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413

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Parana Technologies

USA . 111 parts In-Stock

1+ parts

-

100+ parts

$2.158

1k+ parts

-

10k+ parts

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111

-

$2.158

-

-

Kepictronics

USA . 72 parts In-Stock

1+ parts

-

100+ parts

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72

-

-

-

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Overview

Unlock a new level of efficiency with the STF33N65M2 from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET is designed for optimal switching performance, bringing reliability and durability to your applications. With its high breakdown voltage and impressive current handling, it’s perfect for demanding environments. Trust in STMicroelectronics’ renowned quality to elevate your projects and drive real value in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers durability and resistance to environmental factors, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and speed in switching applications, making them ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against voltage spikes, adding reliability to the design and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power in various electronic circuits.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage rating ensures the FET can handle substantial voltage levels, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape of this package aids in efficient layout and space-saving in electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical and electrical connections, which are essential for high-power applications.

Operating Mode: ENHANCEMENT MODE

Being in enhancement mode allows the FET to be normally off, reducing power consumption when idle.

Maximum Pulsed Drain Current (IDM): 96 A

A high pulsed drain current capability means the FET can handle bursts of high current, making it suitable for dynamic loads.

Avalanche Energy Rating (EAS): 780 mJ

This rating indicates that the FET can survive energy pulses, providing additional reliability in transient conditions.

Maximum Drain Current (Abs) (ID): 24 A

With a maximum continuous drain current of 24 A, this FET is efficient for controlling loads in power applications.

No. of Terminals: 3

The three-terminal configuration allows for easy integration into various circuit designs while maintaining functionality.

Maximum Power Dissipation (Abs): 34 W

A significant power dissipation rating ensures that the FET can handle heat effectively without thermal failure.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced stability and allows for easier mounting in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it efficient for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function reliably in demanding thermal environments.

Transistor Element Material: SILICON

Silicon-based transistors are well-known for their stability and performance in a wide range of electronic circuits.

Minimum Operating Temperature: -55 °C

The ability to operate in extreme low temperatures ensures reliability in harsh environments.

Maximum Drain-Source On Resistance: 0.14 ohm

Low on-resistance improves efficiency and decreases heat generation during operation, enhancing overall performance.

Terminal Position: SINGLE

Single terminal position simplifies the design process and installation, making it more user-friendly.

Case Connection: ISOLATED

Isolated case connections provide additional safety by reducing the risk of shorts and enhancing reliability in operation.

Technical Specifications

Power Field Effect Transistors (FET) STF33N65M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

780 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF33N65M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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