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STF30NM50N

STMicroelectronics

STF30NM50N by STMicroelectronics

STF30NM50N by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and 27A max drain current. It operates in enhancement mode with a low on-resistance of 0.115Ω. This robust transistor supports high power dissipation up to 40W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,924 parts In-Stock

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7,924

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Digiode

USA . 4,697 parts In-Stock

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4,697

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Anansix

USA . 2,692 parts In-Stock

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2,692

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IDEA Electronic Components Group

UK . 1,818 parts In-Stock

1+ parts

$1.464

100+ parts

-

1k+ parts

$1.317

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1,818

$1.464

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$1.317

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MKK Technologies

India . 2,057 parts In-Stock

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$2.752

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2,057

$2.752

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DigiPath Technology Company

USA . 2,057 parts In-Stock

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$2.752

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2,057

$2.752

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AZTECH Wire

Italy . 1,170 parts In-Stock

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$9.320

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1,170

$9.320

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 18,612 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 6,203 parts In-Stock

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Corphita

USA . 4,060 parts In-Stock

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4,060

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Alle Elektronik GmbH

Germany . 3,701 parts In-Stock

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3,701

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Parana Technologies

USA . 2,115 parts In-Stock

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$1.750

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$1.750

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Overview

Unlock the power of efficiency with the STF30NM50N from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this high-performance N-channel FET, perfect for demanding switching applications. With impressive durability and reliability, it ensures optimal performance in energy management systems, motor control, and industrial automation. Elevate your projects with a trusted solution that maximizes value and enhances productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and ensures resistance to environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically provide better performance and lower on-resistance compared to P-channel, making this FET efficient for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and adds protection against voltage spikes, enhancing overall reliability.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET enables efficient control of power electronics, suitable for a variety of high-performance circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage allows this FET to handle demanding voltage conditions without failure, ideal for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape contributes to a compact layout, helping to save space in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide stability and ease of soldering in assembly, making the product user-friendly for prototyping and production.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a completely off-state when no voltage is applied, reducing power consumption in idle states.

Maximum Pulsed Drain Current (IDM): 108 A

With a pulsed current capability of 108 A, this FET can handle demanding current surges, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 900 mJ

This high avalanche energy rating provides added robustness against transient voltage spikes, ensuring enhanced reliability in challenging environments.

Maximum Drain Current (Abs) (ID): 27 A

The maximum drain current capacity of 27 A ensures that the FET can handle substantial loads, suitable for high-power applications.

No. of Terminals: 3

The three-terminal configuration simplifies circuit connections and is adequate for various switching applications.

Maximum Power Dissipation (Abs): 40 W

With a power dissipation capacity of 40 W, this FET can efficiently operate without overheating, ensuring reliable performance.

Package Style (Meter): FLANGE MOUNT

Flange mount ensures good mechanical stability and heat dissipation, making it suitable for various mounting configurations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high efficiency and fast switching speeds, enhancing overall performance in electronic circuits.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures ensures reliability and performance even in extreme environmental conditions.

Transistor Element Material: SILICON

Silicon offers excellent thermal stability and electrical properties, making this FET suitable for high-performance applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and protective qualities, which contribute to the longevity of the connections.

Maximum Drain-Source On Resistance: 0.115 ohm

A low on-resistance value minimizes power loss and improves energy efficiency during operation, making this product ideal for high-efficiency designs.

Terminal Position: SINGLE

Single terminal position reduces complexity in circuit design and allows for easier integration into systems.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing unintended connections and ensuring reliable operation under various conditions.

Technical Specifications

Power Field Effect Transistors (FET) STF30NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF30NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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