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STF25NM60ND

STMicroelectronics

STF25NM60ND by STMicroelectronics

STF25NM60ND from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 21A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$2.140

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 965 parts In-Stock

1+ parts

$2.140

100+ parts

$2.030

1k+ parts

$1.920

10k+ parts

-

965

$2.140

$2.030

$1.920

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,772

-

-

-

-

Digiode

USA . 3,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,902

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

-

-

-

-

Anansix

USA . 545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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545

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,919 parts In-Stock

1+ parts

$0.404

100+ parts

-

1k+ parts

$0.363

10k+ parts

-

1,919

$0.404

-

$0.363

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$0.598

100+ parts

$0.544

1k+ parts

$0.490

10k+ parts

-

15

$0.598

$0.544

$0.490

-

MKK Technologies

India . 1,869 parts In-Stock

1+ parts

$0.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,869

$0.759

-

-

-

DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$0.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,869

$0.759

-

-

-

AZTECH Wire

Italy . 113 parts In-Stock

1+ parts

$10.520

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$10.520

-

-

-

RC Electronics

USA . 47,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

47,202

-

-

-

-

Corphita

USA . 4,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,735

-

-

-

-

Alle Elektronik GmbH

Germany . 3,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,596

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

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Perfect Parts

USA . 1,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,579

-

-

-

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

-

-

Parana Technologies

USA . 417 parts In-Stock

1+ parts

-

100+ parts

$0.483

1k+ parts

-

10k+ parts

-

417

-

$0.483

-

-

Overview

Experience unparalleled performance with the STF25NM60ND from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET combines robust reliability and high efficiency, perfect for demanding switching applications. With its advanced technology and built-in diode, it ensures seamless operation under challenging conditions. Elevate your designs with a trusted component that delivers exceptional value, enhancing both performance and durability in your electrical projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for lower on-resistance and higher efficiency in switching applications, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode provides added protection and simplifies circuit design by integrating functionality in one device.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for power management and control in various electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage (600 V) ensures reliability and stability in high-voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and assembly, making it easier to integrate into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and is preferred for applications requiring robust connections.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode offers better control and higher efficiency, making it suitable for modern electronic applications.

Maximum Pulsed Drain Current (IDM): 84 A

The ability to handle a pulsed current of 84 A makes this FET capable of supporting high-power applications effectively.

Avalanche Energy Rating (EAS): 850 mJ

An avalanche energy rating of 850 mJ indicates resilience against transient events, adding to the device's robustness in varying conditions.

Maximum Drain Current (Abs) (ID): 21 A

A maximum drain current of 21 A allows for versatile use in power circuits, accommodating a range of load requirements.

No. of Terminals: 3

With 3 terminals, this FET provides a simple yet effective design, making it easy to integrate into electronic circuits.

Maximum Power Dissipation (Abs): 40 W

The capability to dissipate up to 40 W of power ensures the FET can operate efficiently without overheating in various applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides strong mechanical support and ease of installation, suitable for fixed applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOSFET technology ensures high switching speeds and efficiency, making this device ideal for advanced electronic circuits.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and optimal performance even in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material contributes to good thermal conductivity and efficient electrical performance, essential for reliable operation.

Maximum Drain Current (ID): 21 A

Redundant information with a maximum drain current of 21 A indicates versatility in handling various load conditions.

Maximum Drain-Source On Resistance: 0.16 ohm

A low on-resistance of 0.16 ohm minimizes power loss during operation, improving efficiency and overall system performance.

Terminal Position: SINGLE

The single terminal position simplifies integration into circuits, providing ease of design while maintaining performance.

Case Connection: ISOLATED

An isolated case connection enhances safety and performance by preventing unwanted currents from affecting device operation.

Technical Specifications

Power Field Effect Transistors (FET) STF25NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF25NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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