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STF25NM50N

STMicroelectronics

STF25NM50N by STMicroelectronics

STF25NM50N by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and 22A max drain current. It operates in enhancement mode with a low on-resistance of 0.14Ω. This robust transistor supports high power dissipation up to 40W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,018 parts In-Stock

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8,018

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Digiode

USA . 3,883 parts In-Stock

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3,883

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Anansix

USA . 2,557 parts In-Stock

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2,557

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Zilex Electronics Inc.

Canada . 800 parts In-Stock

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800

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,894 parts In-Stock

1+ parts

$1.589

100+ parts

-

1k+ parts

$1.430

10k+ parts

-

1,894

$1.589

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$1.430

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MKK Technologies

India . 524 parts In-Stock

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$2.988

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524

$2.988

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DigiPath Technology Company

USA . 524 parts In-Stock

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$2.988

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524

$2.988

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Component Stockers USA

USA . 25 parts In-Stock

1+ parts

$5.790

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25

$5.790

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AZTECH Wire

Italy . 714 parts In-Stock

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$13.860

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714

$13.860

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Kepictronics

USA . 5,500 parts In-Stock

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5,500

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A-Z Elektronik GmbH

Germany . 5,472 parts In-Stock

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5,472

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Corphita

USA . 4,826 parts In-Stock

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4,826

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Alle Elektronik GmbH

Germany . 4,742 parts In-Stock

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4,742

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Parana Technologies

USA . 91 parts In-Stock

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$1.900

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91

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$1.900

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Unlock unparalleled efficiency and reliability with the STF25NM50N by STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET excels in switching applications, delivering exceptional performance under demanding conditions. With its high breakdown voltage and impressive current handling, it’s perfect for industrial automation and power management systems. Choose quality you can trust and elevate your designs with STMicroelectronics’ cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight material provides excellent thermal performance, making the FET suitable for high-temperature and high-efficiency applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for lower on-resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves protection against voltage spikes, enhancing the reliability of the FET in switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast operation and low power loss.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage allows the FET to handle demanding applications in power electronics without failure.

Package Shape: RECTANGULAR

The rectangular packaging allows for efficient use of PCB space, making it easy to integrate into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust connections and better durability in mechanical stress conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers better control over the flow of current, thus improving overall circuit performance.

Maximum Pulsed Drain Current (IDM): 88 A

High pulsed current rating allows for short bursts of high power applications, making this FET versatile and effective.

Avalanche Energy Rating (EAS): 350 mJ

High avalanche energy rating enhances reliability under fault conditions, making the FET suitable for industrial applications.

Maximum Drain Current (Abs) (ID): 22 A

With a solid maximum drain current, it can effectively drive various moderately complex circuits without overheating.

No. of Terminals: 3

A 3-terminal configuration simplifies circuit design and minimizes space on PCBs, making it practical for compact solutions.

Maximum Power Dissipation (Abs): 40 W

High power dissipation capacity allows for efficient operation in demanding applications, reducing the risk of thermal issues.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides robust mechanical support and excellent thermal management, critical for power devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures fast switching speeds and lower power consumption, ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature allows for use in harsher environments, ensuring reliability and longevity.

Transistor Element Material: SILICON

Silicon is a standard and well-understood material, providing good performance, availability, and cost-effectiveness.

Terminal Finish: MATTE TIN

Matte tin finish offers better solderability and corrosion resistance, enhancing the product's overall durability.

Maximum Drain Current (ID): 22 A

This ensures the FET can handle a significant amount of current without performance degradation, making it very reliable.

Maximum Drain-Source On Resistance: 0.14 ohm

Low on-resistance minimizes power losses during operation, leading to improved efficiency in the overall circuit.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout, making it easier to integrate into various circuits.

Case Connection: ISOLATED

An isolated case connection prevents unwanted interactions with other circuit components, enhancing overall performance.

Technical Specifications

Power Field Effect Transistors (FET) STF25NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF25NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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