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STF17N62K3

STMicroelectronics

STF17N62K3 by STMicroelectronics

STF17N62K3 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 620V breakdown voltage, 60A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$5.260

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 727 parts In-Stock

1+ parts

$5.260

100+ parts

$2.549

1k+ parts

$2.438

10k+ parts

-

727

$5.260

$2.549

$2.438

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 637 parts In-Stock

1+ parts

$5.880

100+ parts

-

1k+ parts

-

10k+ parts

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637

$5.880

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Vyrian

USA . 7,651 parts In-Stock

1+ parts

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7,651

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Anansix

USA . 1,614 parts In-Stock

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1,614

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1,000

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Bristol Electronics

USA . 928 parts In-Stock

1+ parts

-

100+ parts

$1.792

1k+ parts

$1.575

10k+ parts

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928

-

$1.792

$1.575

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Dan-Mar Components

USA . 928 parts In-Stock

1+ parts

-

100+ parts

-

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928

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 331 parts In-Stock

1+ parts

$0.636

100+ parts

-

1k+ parts

$0.572

10k+ parts

-

331

$0.636

-

$0.572

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MKK Technologies

India . 645 parts In-Stock

1+ parts

$1.195

100+ parts

-

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645

$1.195

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DigiPath Technology Company

USA . 645 parts In-Stock

1+ parts

$1.195

100+ parts

-

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645

$1.195

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Corphita

USA . 2,292 parts In-Stock

1+ parts

$5.571

100+ parts

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2,292

$5.571

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Microchip USA

USA . 4,711 parts In-Stock

1+ parts

$15.204

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4,711

$15.204

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,826 parts In-Stock

1+ parts

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$0.760

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1,826

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$0.760

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Epart123

USA . 1,000 parts In-Stock

1+ parts

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

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1,000

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Alle Elektronik GmbH

Germany . 727 parts In-Stock

1+ parts

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727

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Overview

Unlock the power of innovation with the STF17N62K3 from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a top-tier N-channel Power FET that ensures reliable switching performance in demanding applications. With superior energy efficiency and robust reliability, this device is perfect for industrial automation, automotive systems, and renewable energy solutions, empowering you to elevate your projects while maximizing operational benefits. Choose STF17N62K3 for unmatched performance and durability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, ensuring reliability in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better efficiency and performance in switching applications, making this FET suitable for high-speed operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection and convenience, minimizing the need for external components in your circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures rapid on/off control, enhancing the performance of your electronic devices.

Minimum DS Breakdown Voltage: 620 V

A high breakdown voltage makes this FET suitable for high-voltage applications, ensuring safety and reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it ideal for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering, enhancing the durability of the component in the assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power loss and higher efficiency, making this FET a great choice for modern electronic applications.

Maximum Pulsed Drain Current (IDM): 60 A

The ability to handle high pulsed currents makes this FET suitable for applications requiring brief but powerful bursts of power.

Avalanche Energy Rating (EAS): 315 mJ

A high avalanche energy rating indicates reliability under transient conditions, protecting your circuit from unexpected voltage spikes.

Maximum Drain Current (Abs) (ID): 15 A

With a maximum drain current of 15 A, this FET supports a wide range of applications while maintaining thermal stability.

No. of Terminals: 3

Three terminals facilitate simple circuit integration, making it easier to implement in various applications.

Maximum Power Dissipation (Abs): 40 W

A high power dissipation rating allows this FET to operate efficiently without overheating, ensuring a longer lifespan.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides excellent heat dissipation and mechanical strength, aiding in reliable long-term performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to fast switching and low power consumption, making this FET optimal for energy-efficient designs.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability in harsh environments, enhancing application versatility.

Transistor Element Material: SILICON

Silicon-based construction provides good performance and temperature stability, which is a standard requirement in many electronic devices.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 15 A

This specification reaffirms the FET's capability to handle substantial current loads, ensuring robust operation in high-demand applications.

Maximum Drain-Source On Resistance: 0.38 ohm

A low on-resistance allows for higher efficiency and reduced power losses during operation, which is crucial for optimal circuit performance.

Terminal Position: SINGLE

Single terminal position simplifies layout designs and enhances circuit organization, making integration straightforward.

Case Connection: ISOLATED

Isolated case connections improve safety by reducing the risk of interference with other components, thus enhancing circuit reliability.

Technical Specifications

Power Field Effect Transistors (FET) STF17N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

315 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF17N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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