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STD8N10L1

STMicroelectronics

STD8N10L1 by STMicroelectronics

STD8N10L1 by STMicroelectronics is a N-CHANNEL FET with 8A max drain current and 45W max power dissipation. It operates in enhancement mode, suitable for applications requiring high power handling such as motor control and power supplies.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,595 parts In-Stock

1+ parts

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4,595

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Digiode

USA . 3,792 parts In-Stock

1+ parts

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3,792

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Anansix

USA . 1,685 parts In-Stock

1+ parts

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1,685

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,876 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

$0.639

10k+ parts

-

1,876

$0.710

-

$0.639

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MKK Technologies

India . 2,053 parts In-Stock

1+ parts

$1.336

100+ parts

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2,053

$1.336

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DigiPath Technology Company

USA . 2,053 parts In-Stock

1+ parts

$1.336

100+ parts

-

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2,053

$1.336

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Parana Technologies

USA . 2,359 parts In-Stock

1+ parts

-

100+ parts

$0.849

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-

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2,359

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$0.849

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Corphita

USA . 1,242 parts In-Stock

1+ parts

-

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1,242

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Overview

Unleash the power of innovation with the STD8N10L1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors (FET) like no other. The N-CHANNEL configuration and ENHANCEMENT MODE operating mode of this transistor offer unparalleled performance and reliability for a wide range of applications. With a maximum drain current of 8A and a maximum power dissipation of 45W, this METAL-OXIDE SEMICONDUCTOR technology ensures optimal efficiency even in the most demanding environments. Elevate your projects with the STD8N10L1 and experience the value and benefits that only STMicroelectronics can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON-resistance and higher switching speeds compared to P-CHANNEL FETs, making them suitable for high-performance applications.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and makes it easier to control the FET in a system.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs require a positive voltage on the gate to turn the FET on, providing better control over the device in various applications.

Maximum Drain Current (Abs) (ID): 8 A

With a high maximum drain current rating, this FET can handle large currents without overheating, making it suitable for power applications.

Maximum Power Dissipation (Abs): 45 W

The high power dissipation capability allows the FET to handle high power levels without getting damaged, ensuring reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers good performance characteristics with low leakage current and high reliability, making it suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate reliably in high-temperature environments without performance degradation.

Maximum Drain Current (ID): 8 A

The high maximum drain current rating ensures that the FET can handle large current loads, making it suitable for power applications.

Technical Specifications

Power Field Effect Transistors (FET) STD8N10L1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

STD8N10L1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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