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STD8N65M5

STMicroelectronics

STD8N65M5 by STMicroelectronics

STD8N65M5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 28A pulsed drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

$2.975

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,450 parts In-Stock

1+ parts

$1.278

100+ parts

$1.218

1k+ parts

$1.159

10k+ parts

-

1,450

$1.278

$1.218

$1.159

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.720

-

-

-

Farnell

UK . 1,760 parts In-Stock

1+ parts

$2.750

100+ parts

$1.370

1k+ parts

$0.981

10k+ parts

-

1,760

$2.750

$1.370

$0.981

-

Mouser Electronics

USA . 1,872 parts In-Stock

1+ parts

$3.200

100+ parts

$1.480

1k+ parts

$1.160

10k+ parts

-

1,872

$3.200

$1.480

$1.160

-

DigiKey

USA . 3,004 parts In-Stock

1+ parts

$3.260

100+ parts

$1.475

1k+ parts

$1.257

10k+ parts

$1.027

3,004

$3.260

$1.475

$1.257

$1.027

Newark

USA . 1,759 parts In-Stock

1+ parts

$3.660

100+ parts

$1.940

1k+ parts

$1.620

10k+ parts

-

1,759

$3.660

$1.940

$1.620

-

Element14

Singapore . 1,760 parts In-Stock

1+ parts

$4.620

100+ parts

$2.310

1k+ parts

$1.660

10k+ parts

-

1,760

$4.620

$2.310

$1.660

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Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,500

-

-

-

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Verical

USA . 1,450 parts In-Stock

1+ parts

-

100+ parts

$1.218

1k+ parts

$1.159

10k+ parts

-

1,450

-

$1.218

$1.159

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,054 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

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4,054

$1.110

-

-

-

TME

Poland . 4 parts In-Stock

1+ parts

$1.180

100+ parts

-

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-

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4

$1.180

-

-

-

Digiode

USA . 4,779 parts In-Stock

1+ parts

$1.364

100+ parts

-

1k+ parts

-

10k+ parts

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4,779

$1.364

-

-

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Cyclops Electronics Ltd

UK . 15,000 parts In-Stock

1+ parts

-

100+ parts

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15,000

-

-

-

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Kruse Electronics AG

Switzerland . 1,609 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,609

-

-

-

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Anansix

USA . 1,253 parts In-Stock

1+ parts

-

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1,253

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-

-

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ACDS - Activité Composants Distribution Service

France . 233 parts In-Stock

1+ parts

-

100+ parts

-

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233

-

-

-

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Bristol Electronics

USA . 233 parts In-Stock

1+ parts

-

100+ parts

$0.954

1k+ parts

-

10k+ parts

-

233

-

$0.954

-

-

Dan-Mar Components

USA . 233 parts In-Stock

1+ parts

-

100+ parts

-

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233

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ComSIT Distribution GmbH

Germany . 215 parts In-Stock

1+ parts

-

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215

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,762 parts In-Stock

1+ parts

$1.292

100+ parts

-

1k+ parts

-

10k+ parts

-

3,762

$1.292

-

-

-

IDEA Electronic Components Group

UK . 392 parts In-Stock

1+ parts

$1.611

100+ parts

-

1k+ parts

$1.450

10k+ parts

-

392

$1.611

-

$1.450

-

Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

$2.460

100+ parts

$1.620

1k+ parts

$1.100

10k+ parts

-

2,500

$2.460

$1.620

$1.100

-

MKK Technologies

India . 1,496 parts In-Stock

1+ parts

$3.029

100+ parts

-

1k+ parts

-

10k+ parts

-

1,496

$3.029

-

-

-

DigiPath Technology Company

USA . 1,496 parts In-Stock

1+ parts

$3.029

100+ parts

-

1k+ parts

-

10k+ parts

-

1,496

$3.029

-

-

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Microchip USA

USA . 8,129 parts In-Stock

1+ parts

$8.072

100+ parts

-

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-

10k+ parts

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8,129

$8.072

-

-

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Kepictronics

USA . 66,000 parts In-Stock

1+ parts

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100+ parts

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66,000

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-

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

USA . 29,814 parts In-Stock

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29,814

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QUARKTWIN TECHNOLOGY LTD

USA . 10,021 parts In-Stock

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10,021

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Epart123

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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$1.000

10k+ parts

$1.000

10,000

-

-

$1.000

$1.000

GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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-

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Alle Elektronik GmbH

Germany . 4,916 parts In-Stock

1+ parts

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100+ parts

-

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4,916

-

-

-

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A-Z Elektronik GmbH

Germany . 4,673 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,673

-

-

-

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Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

-

100+ parts

$1.926

1k+ parts

-

10k+ parts

-

1,544

-

$1.926

-

-

Overview

Experience unparalleled efficiency with the STD8N65M5 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality N-channel Power FET is designed for robust switching applications, ensuring reliable performance in demanding environments. With its compact package and built-in diode, it offers seamless integration and thermal management, empowering your projects with enhanced power control. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package ensures lightweight construction and excellent insulation properties, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and faster switching speeds, making this product ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability and simplifies circuit design, protecting against voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast response times and reduced losses, enhancing overall circuit efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, reducing manufacturing costs and space requirements.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage makes this FET suitable for high-voltage applications, ensuring robust performance under demanding conditions.

Package Shape: RECTANGULAR

The rectangular package facilitates space-efficient layouts on PCBs, allowing for more effective use of board space.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and excellent mechanical stability, ensuring a reliable connection in assembled devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to low ON-resistance and minimal power loss, enhancing the efficiency of the circuit.

Maximum Pulsed Drain Current (IDM): 28 A

The high pulsed drain current capability allows this FET to handle demanding peak currents in applications without failure.

Avalanche Energy Rating (EAS): 120 mJ

A significant avalanche energy rating indicates robust performance and the ability to withstand energy surges, enhancing reliability.

Maximum Drain Current (Abs) (ID): 7 A

This FET can reliably handle a maximum drain current of 7 A, suitable for a variety of applications requiring moderate power.

No. of Terminals: 2

Having only 2 terminals simplifies connections and reduces complexity in circuit designs, facilitating easier integration.

Maximum Power Dissipation (Abs): 70 W

A maximum power dissipation of 70 W allows this device to operate effectively in power applications without overheating issues.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the footprint on the PCB, enabling more compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to low gate drive power requirements and fast switching speeds, making this FET efficient for operation.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures ensures reliability and performance in demanding environments, broadening its application scope.

Transistor Element Material: SILICON

Silicon as the primary element guarantees good thermal conductivity and electrical performance, ensuring reliable operation.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and resistance to corrosion, enhancing the durability of connections.

Maximum Drain Current (ID): 7 A

Another mention of the maximum drain current emphasizes the device's capability to handle substantial current loads effectively.

Maximum Drain-Source On Resistance: 0.6 ohm

Low on-resistance minimizes power loss and heat generation during operation, improving overall circuit efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies layout design, allowing for straightforward circuit integration.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures compliance with standard reflow soldering processes, aiding manufacturability.

Peak Reflow Temperature °C: 260

A peak temperature of 260 °C is suitable for modern soldering techniques, ensuring compatibility with various assembly methods.

Technical Specifications

Power Field Effect Transistors (FET) STD8N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD8N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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