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STD5NK50Z-1

STMicroelectronics

STD5NK50Z-1 by STMicroelectronics

STD5NK50Z-1 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 4.4A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 14,020 parts In-Stock

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Vyrian

USA . 7,246 parts In-Stock

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Anansix

USA . 2,774 parts In-Stock

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Digiode

USA . 1,187 parts In-Stock

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

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$0.433

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-

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$0.390

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1,549

$0.433

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$0.390

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MKK Technologies

India . 952 parts In-Stock

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$0.815

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952

$0.815

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DigiPath Technology Company

USA . 952 parts In-Stock

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$0.815

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952

$0.815

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AZTECH Wire

Italy . 215 parts In-Stock

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$16.430

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215

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,049 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,416 parts In-Stock

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Corphita

USA . 2,775 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,040 parts In-Stock

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Parana Technologies

USA . 376 parts In-Stock

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$0.518

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Speed Components Ltd (Excess)

Israel . 46 parts In-Stock

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Overview

Unlock unparalleled performance with the STD5NK50Z-1 Power FET from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel transistor is designed for seamless switching applications, delivering exceptional reliability and efficiency. With its advanced technology and built-in diode, it ensures superior thermal management and performance under demanding conditions. Elevate your projects with this high-quality component that combines value, durability, and versatility for greater design freedom.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material provides excellent insulation and mechanical strength, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their lower on-resistance and higher efficiency, which enhances performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor from reverse voltage spikes, improving reliability in various switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for fast and efficient operation, making it ideal for power management solutions.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage enables use in high-voltage applications, providing flexibility in system design.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier mounting and integration into circuit boards, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections, ensuring greater mechanical stability and easier soldering in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer higher efficiency and better performance when actively driven, suitable for modern electronic devices.

Maximum Pulsed Drain Current (IDM): 17.6 A

This high pulsed drain current capacity is beneficial for applications requiring short bursts of high power, enhancing versatility.

Avalanche Energy Rating (EAS): 130 mJ

A high avalanche energy rating helps ensure reliability when subjected to voltage transients, making it suitable for rugged environments.

Maximum Drain Current (Abs) (ID): 4.4 A

This maximum drain current allows for substantial power handling capabilities, suitable for a variety of electronic applications.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design, while efficiently managing connections in compact layouts.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation rating allows the FET to handle significant power without overheating, supporting reliable operation in demanding applications.

Package Style (Meter): IN-LINE

The in-line package style eases integration into various systems, enhancing design flexibility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high speed and efficiency, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability and performance stability in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material provides a good balance of performance and cost, making it widely used in power electronics.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish offers good solderability and enhances corrosion resistance, contributing to long-term reliability.

Maximum Drain Current (ID): 4.4 A

This maximum drain current rating ensures robust performance across a wide range of applications.

Maximum Drain-Source On Resistance: 1.5 ohm

Low on-resistance improves efficiency, reducing power losses during operation, which is crucial in power management applications.

Terminal Position: SINGLE

A single terminal position simplifies the integration process, aiding in straightforward circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

This reflow temperature capability ensures compatibility with standard soldering processes, simplifying assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering without damaging the component, enhancing production efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STD5NK50Z-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

130 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

4.4 A

Maximum Drain Current (ID):

4.4 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

17.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD5NK50Z-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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