Loading...

STD55NH2LLT4

STMicroelectronics

STD55NH2LLT4 by STMicroelectronics

STD55NH2LLT4 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 55 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,146

-

-

-

-

Digiode

USA . 2,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,455

-

-

-

-

Anansix

USA . 1,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,397

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 81 parts In-Stock

1+ parts

$1.291

100+ parts

-

1k+ parts

$1.162

10k+ parts

-

81

$1.291

-

$1.162

-

MKK Technologies

India . 845 parts In-Stock

1+ parts

$2.427

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$2.427

-

-

-

DigiPath Technology Company

USA . 845 parts In-Stock

1+ parts

$2.427

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$2.427

-

-

-

AZTECH Wire

Italy . 1,133 parts In-Stock

1+ parts

$21.940

100+ parts

-

1k+ parts

-

10k+ parts

-

1,133

$21.940

-

-

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,401

-

-

-

-

Corphita

USA . 3,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,864

-

-

-

-

Alle Elektronik GmbH

Germany . 3,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,716

-

-

-

-

Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

-

100+ parts

$1.543

1k+ parts

-

10k+ parts

-

2,303

-

$1.543

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Overview

Unlock unparalleled performance with the STD55NH2LLT4 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Power FET delivers exceptional switching efficiency and reliability, making it ideal for demanding applications like power management and motor control. With robust thermal performance and compact design, it ensures optimal operation under pressure, offering unmatched value to engineers and designers seeking quality and durability. Elevate your projects with confidence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher efficiency and faster switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and simplifies design, making it a convenient choice for designers.

Transistor Application: SWITCHING

Optimized for switching applications, this transistor can effectively manage power control, important for efficiency in electronic circuits.

Surface Mount: YES

Surface mount design allows for compact PCB layouts and automated assembly processes, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24 V offers good protection against voltage spikes, enhancing circuit reliability.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, facilitating easier integration into various designs.

Terminal Form: GULL WING

Gull wing terminals ensure reliable solder joints and ease of handling during assembly, providing consistent performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control of conductivity, leading to lower on-resistance and higher efficiency.

Maximum Pulsed Drain Current (IDM): 160 A

This high pulsed current rating makes it suitable for applications requiring high burst currents, ensuring robust performance.

Avalanche Energy Rating (EAS): 600 mJ

A high avalanche energy rating indicates the ability to withstand transient energy spikes, providing additional protection in power circuits.

Maximum Drain Current (Abs) (ID): 55 A

This specification allows for sufficient current handling, making it suitable for a variety of power applications.

No. of Terminals: 2

With only two terminals, the device is easy to connect, simplifying circuit design and implementation.

Maximum Power Dissipation (Abs): 60 W

A high power dissipation capability means it can handle demanding applications without overheating, enhancing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-sensitive applications, promoting design flexibility.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low drive power, making it efficient for digital and analog circuits.

Maximum Operating Temperature: 175 °C

A high operating temperature threshold allows for deployment in harsh environments, broadening application potential.

Transistor Element Material: SILICON

Silicon is known for its excellent electrical characteristics and thermal stability, ensuring consistent performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing longevity and reliability.

Maximum Drain Current (ID): 40 A

A maximum drain current of 40 A makes it suitable for versatile power management applications in various electronic devices.

Maximum Drain-Source On Resistance: 0.0135 ohm

Low on-resistance ensures minimal power loss during operation, making it an efficient choice for high-current applications.

Terminal Position: SINGLE

With a single terminal position, it simplifies layout design and routing on PCBs, improving assembly efficiency.

Case Connection: DRAIN

A direct case connection to the drain optimizes thermal performance and simplifies circuit integration.

Technical Specifications

Power Field Effect Transistors (FET) STD55NH2LLT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

55 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.0135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD55NH2LLT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19