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STD36NH02L

STMicroelectronics

STD36NH02L by STMicroelectronics

STD36NH02L by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 30 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for compact power management in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NexGen Digital

USA . 7,439 parts In-Stock

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7,439

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Vyrian

USA . 6,456 parts In-Stock

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6,456

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Digiode

USA . 3,874 parts In-Stock

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3,874

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Anansix

USA . 2,876 parts In-Stock

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2,876

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Lakeland Logistics Inc

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$0.758

100+ parts

-

1k+ parts

$0.682

10k+ parts

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1,668

$0.758

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$0.682

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MKK Technologies

India . 1,890 parts In-Stock

1+ parts

$1.426

100+ parts

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1,890

$1.426

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DigiPath Technology Company

USA . 1,890 parts In-Stock

1+ parts

$1.426

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1,890

$1.426

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AZTECH Wire

Italy . 851 parts In-Stock

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$19.190

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851

$19.190

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Kepictronics

USA . 43,500 parts In-Stock

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43,500

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A-Z Elektronik GmbH

Germany . 7,190 parts In-Stock

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7,190

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Alle Elektronik GmbH

Germany . 3,665 parts In-Stock

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3,665

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Corphita

USA . 3,618 parts In-Stock

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3,618

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Perfect Parts

USA . 1,664 parts In-Stock

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1,664

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Parana Technologies

USA . 260 parts In-Stock

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$0.906

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260

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$0.906

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Overview

Unlock the power of innovation with the STD36NH02L from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance N-channel power FET delivers exceptional efficiency and reliability for a variety of applications, from automotive to industrial systems. With its robust design and compact footprint, it ensures optimal performance while saving space and energy. Experience unparalleled quality and support from a manufacturer renowned for excellence, empowering your projects with cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them advantageous for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against back EMF, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can effectively manage power in a variety of electronic devices.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, contributing to reduced manufacturing costs.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24V makes it suitable for many applications requiring reliable voltage handling.

Package Shape: RECTANGULAR

The rectangular shape supports efficient PCB layout and reduces space consumption in circuit designs.

Terminal Form: GULL WING

The gull wing terminal design allows for easier soldering and improves thermal performance in surface mount applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers higher performance in terms of switching speeds and control, ideal for modern electronics.

Maximum Pulsed Drain Current (IDM): 120 A

A high pulsed drain current capability allows for flexibility in demanding applications, making it robust under transient conditions.

Avalanche Energy Rating (EAS): 200 mJ

The high avalanche energy rating enhances protection against voltage spikes, ensuring safety and reliability in circuits.

Maximum Drain Current (Abs) (ID): 30 A

A maximum drain current of 30A makes this FET suitable for high-current applications, ensuring reliable performance.

No. of Terminals: 2

A simple two-terminal design provides ease of integration and minimizes complexity in circuit design.

Maximum Power Dissipation (Abs): 45 W

With a power dissipation tolerance of 45W, this FET can operate robustly under thermal stress, enhancing durability.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space usage, allowing for compact and efficient electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high-speed operation and low power consumption, essential for energy-efficient designs.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, it is suitable for high-temperature applications and environments.

Transistor Element Material: SILICON

Silicon as an element material ensures excellent electronic properties, crucial for high-performance FETs.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and resistance to oxidation, promoting reliable connections.

Maximum Drain Current (ID): 30 A

Redundant specification restating a maximum drain current of 30A illustrates consistency in high-performance capability.

Maximum Drain-Source On Resistance: 0.026 ohm

The low on-resistance enhances efficiency and minimizes heat generation, making it ideal for power management applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the design, making it easier for integration into various circuit configurations.

Case Connection: DRAIN

The drain case connection is standard for FETs, offering straightforward integration into circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STD36NH02L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD36NH02L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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