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STD2NM60T4

STMicroelectronics

STD2NM60T4 by STMicroelectronics

STD2NM60T4 by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 600V breakdown voltage, 8A max pulsed drain current, and operates at up to 150 °C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,034 parts In-Stock

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6,034

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Anansix

USA . 1,827 parts In-Stock

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1,827

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Digiode

USA . 307 parts In-Stock

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307

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Fibra_Brandt Electronic GMBH

Germany . 20 parts In-Stock

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20

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

1+ parts

$1.203

100+ parts

-

1k+ parts

$1.083

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1,695

$1.203

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$1.083

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MKK Technologies

India . 1,253 parts In-Stock

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$2.263

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1,253

$2.263

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DigiPath Technology Company

USA . 1,253 parts In-Stock

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$2.263

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1,253

$2.263

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AZTECH Wire

Italy . 1,168 parts In-Stock

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$14.470

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1,168

$14.470

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Alle Elektronik GmbH

Germany . 4,516 parts In-Stock

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4,516

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Corphita

USA . 1,809 parts In-Stock

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1,809

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Parana Technologies

USA . 228 parts In-Stock

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$1.439

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228

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$1.439

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Overview

Elevate your power management solutions with the STD2NM60T4 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel FET combines robust performance with exceptional reliability, making it ideal for demanding switching applications. With its compact design and built-in diode, it ensures efficient operation while minimizing energy losses. Experience the ultimate in quality and performance, empowering your designs with unmatched value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reduces production costs, making it a cost-effective choice for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher speed than their P-channel counterparts, making them ideal for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier integration into circuits and protects against reverse current, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers excellent performance in power management and signal processing tasks.

Surface Mount: YES

Surface mount technology helps save circuit board space and allows for automated assembly, which is crucial for modern electronic designs.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures reliability under high voltage conditions, making this FET suitable for industrial applications and power supplies.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on printed circuit boards (PCBs), providing versatility in design.

Terminal Form: GULL WING

Gull wing terminals ensure strong mechanical connections and are ideal for surface mount applications, enhancing solder joint reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide higher efficiency and improved performance in switching applications compared to depletion mode devices.

Maximum Pulsed Drain Current (IDM): 8 A

A high pulsed drain current rating makes this product suitable for applications requiring brief high-current pulses, such as in motor drives.

Avalanche Energy Rating (EAS): 250 mJ

A good avalanche energy rating provides assurance against unexpected voltage spikes, contributing to circuit robustness.

Maximum Drain Current (Abs) (ID): 2 A

This capability allows the FET to handle significant currents without overheating, suitable for low to medium power applications.

No. of Terminals: 2

With only two terminals, this FET simplifies circuit design and reduces assembly complexity, making it ideal for compact designs.

Maximum Power Dissipation (Abs): 46 W

High power dissipation capability enables the FET to handle larger power loads, suitable for power-intensive applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages are space-efficient, making the product ideal for compact devices where board real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching speeds, making this FET highly efficient for diverse applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows this FET to function in extreme environments, enhancing its versatility and lifespan.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material that offers effective performance in a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin offers good corrosion resistance and ensures reliable solderability, which is critical for long-term durability.

Maximum Drain Current (ID): 2 A

This consistent rating ensures that the FET can handle steady-state applications while maintaining performance.

Maximum Drain-Source On Resistance: 3.2 ohm

Low on-resistance minimizes power loss during operation, enhancing efficiency and reducing thermal management requirements.

Terminal Position: SINGLE

A single terminal position simplifies integration and allows for flexible layout options on PCBs.

Technical Specifications

Power Field Effect Transistors (FET) STD2NM60T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

250 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

3.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD2NM60T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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