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STD25P03LT4G

Onsemi

STD25P03LT4G by Onsemi

The Onsemi STD25P03LT4G is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 75A IDM and 0.08 ohm RDS(ON), suitable for ENHANCEMENT MODE operation. This MOSFET comes in a PLASTIC/EPOXY package with GULL WING terminals, meeting AEC-Q101 standards.

Median Price

$0.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,249 parts In-Stock

1+ parts

$0.490

100+ parts

$0.480

1k+ parts

$0.470

10k+ parts

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7,249

$0.490

$0.480

$0.470

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Vyrian

USA . 7,392 parts In-Stock

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7,392

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Digiode

USA . 921 parts In-Stock

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921

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AZTECH Wire

Italy . 943 parts In-Stock

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$9.500

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943

$9.500

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Component Stockers USA

USA . 453 parts In-Stock

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$99.990

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453

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 7,149 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,462 parts In-Stock

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RC Electronics

USA . 4,500 parts In-Stock

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4,500

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SupplyDigital Components

Austria . 4,121 parts In-Stock

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Corphita

USA . 1,663 parts In-Stock

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TANS Electronics

Latvia . 1,099 parts In-Stock

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Problanco Electronics

Mexico . 1,005 parts In-Stock

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Corohmni

South Africa . 353 parts In-Stock

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Unleash the power of innovation with the STD25P03LT4G by Onsemi, a top-tier manufacturer known for delivering quality products. This P-Channel Power FET is designed for switching applications, offering customers a reliable and efficient solution. With a high maximum drain current of 25 A and a low on-resistance of 0.08 ohm, this transistor provides exceptional performance in a compact package. Whether you're designing automotive systems or industrial equipment, this Enhancement Mode FET with built-in diode will enhance your project's efficiency and reliability. Choose Onsemi for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high efficiency, making them ideal for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse currents, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and fast operation.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for various power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact design and efficient placement on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high switching speeds and low on-resistance, improving efficiency and performance.

Maximum Pulsed Drain Current (IDM): 75 A

With a high pulsed drain current rating, this FET can handle sudden power surges and spikes.

Avalanche Energy Rating (EAS): 200 mJ

The high avalanche energy rating allows the transistor to withstand energy spikes, ensuring long-term reliability.

No. of Terminals: 2

Simple two-terminal design for easy integration into circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for denser circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and low power consumption, ideal for power management applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring consistent performance and durability.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Maximum Drain Current (ID): 25 A

With a high drain current rating, this FET can handle high power loads without overheating.

Maximum Drain-Source On Resistance: 0.08 ohm

Low on-resistance allows for efficient power flow and minimal power loss, improving overall system efficiency.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and installation, reducing complexity and potential errors.

Case Connection: DRAIN

Drain connection for easy integration into circuit designs that require drain connections for power flow.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high reliability and quality, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STD25P03LT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

75 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD25P03LT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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