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STD2NC60

STMicroelectronics

STD2NC60 by STMicroelectronics

STD2NC60 by STMicroelectronics is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max Pulsed Drain Current of 8A and an Avalanche Energy Rating of 80mJ. This ENHANCEMENT MODE transistor operates at up to 150°C and has a Max Power Dissipation of 60W in a SMALL OUTLINE package.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,409 parts In-Stock

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Anansix

USA . 1,984 parts In-Stock

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Vyrian

USA . 798 parts In-Stock

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798

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ComSIT Distribution GmbH

Germany . 320 parts In-Stock

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320

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ComSIT USA

USA . 320 parts In-Stock

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320

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Velocity Electronics

USA . 249 parts In-Stock

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249

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Nova Conductors

Japan . 150 parts In-Stock

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150

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LittleDiode

UK . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,011 parts In-Stock

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$0.418

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$0.376

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1,011

$0.418

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MKK Technologies

India . 1,609 parts In-Stock

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$0.785

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$0.785

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DigiPath Technology Company

USA . 1,609 parts In-Stock

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$0.785

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$0.785

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Corohmni

South Africa . 337 parts In-Stock

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$1.848

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$1.848

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Aztec Data Supply Inc.

USA . 169 parts In-Stock

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$1.864

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AZTECH Wire

Italy . 798 parts In-Stock

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$12.732

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Ampacity Inc.

Singapore . 1,549 parts In-Stock

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$26.050

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Continental Prestige Electronics

USA . 4,711 parts In-Stock

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Argo Parts USA

USA . 4,527 parts In-Stock

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Corphita

USA . 4,070 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 506 parts In-Stock

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$0.499

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Assy Fe

Spain . 151 parts In-Stock

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Overview

Unlock the power of the STD2NC60 by STMicroelectronics, a high-quality N-CHANNEL Power Field Effect Transistor with a built-in diode. Ideal for switching applications, this transistor offers reliable performance and efficiency. With a maximum breakdown voltage of 600V and an avalanche energy rating of 80mJ, this component ensures seamless operation even under high stress conditions. Trust in STMicroelectronics' expertise in semiconductor technology to deliver the best-in-class solutions. Experience the value and benefits of the STD2NC60 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher mobility, making them suitable for high-frequency switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making this FET convenient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient control over the flow of current in a circuit.

Surface Mount: YES

Being surface mountable allows for easy and compact placement on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications without risk of damage or failure.

Maximum Pulsed Drain Current (IDM): 8 A

The high pulsed drain current rating allows for handling short-duration high current spikes, making this FET suitable for demanding applications.

Maximum Power Dissipation (Abs): 60 W

The high power dissipation capability ensures reliability and long-term performance under heavy load conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) STD2NC60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

80 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

3.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD2NC60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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