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STB5NK52ZD-1

STMicroelectronics

STB5NK52ZD-1 by STMicroelectronics

STB5NK52ZD-1 by STMicroelectronics is an N-channel FET designed for switching applications. It features a 520V breakdown voltage, 17.6A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,551 parts In-Stock

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8,551

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Anansix

USA . 2,192 parts In-Stock

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2,192

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Digiode

USA . 2,133 parts In-Stock

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2,133

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IDEA Electronic Components Group

UK . 1,052 parts In-Stock

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$0.811

100+ parts

-

1k+ parts

$0.729

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1,052

$0.811

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$0.729

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MKK Technologies

India . 641 parts In-Stock

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$1.524

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641

$1.524

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DigiPath Technology Company

USA . 641 parts In-Stock

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$1.524

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641

$1.524

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AZTECH Wire

Italy . 1,080 parts In-Stock

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$21.330

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$21.330

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,775 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,580 parts In-Stock

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5,580

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,850 parts In-Stock

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4,850

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Perfect Parts

USA . 869 parts In-Stock

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Corphita

USA . 652 parts In-Stock

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Parana Technologies

USA . 52 parts In-Stock

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$0.969

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$0.969

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Overview

Unlock exceptional performance and reliability with the STB5NK52ZD-1 from STMicroelectronics! This N-channel power FET is designed for efficient switching applications, delivering outstanding durability with a robust breakdown voltage of 520V. Renowned for their quality and innovation, STMicroelectronics ensures you get superior components that enhance your projects. Experience significant energy savings, improved thermal management, and unmatched flexibility in your designs—invest in excellence today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide better performance and efficiency in switching applications, making this product ideal for high-speed operations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and provides additional protection, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficiency in power management.

Minimum DS Breakdown Voltage: 520 V

A high breakdown voltage indicates good robustness and capability to handle high voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs and simplifies mounting.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides strong mechanical support and is easier to work with in certain assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for more efficient control of the transistor, making it suitable for a variety of applications.

Maximum Pulsed Drain Current (IDM): 17.6 A

This capability allows the transistor to handle high power spikes, making it suitable for demanding applications where transient loads are common.

Avalanche Energy Rating (EAS): 170 mJ

A high avalanche energy rating indicates that the device can tolerate significant energy surges without damage, enhancing reliability.

Maximum Drain Current (Abs) (ID): 4.4 A

With a maximum drain current rating of 4.4 A, this FET can handle moderate current loads, making it suitable for various applications.

No. of Terminals: 3

Featuring three terminals allows for simpler circuit designs while offering essential functionality.

Maximum Power Dissipation (Abs): 70 W

The ability to dissipate up to 70 W of power indicates that this FET can operate efficiently without overheating in many applications.

Package Style (Meter): IN-LINE

The in-line package style allows for straightforward integration into existing designs, facilitating ease of use.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high efficiency and low power consumption, making this product a great choice for modern applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows for reliable performance in demanding environments.

Transistor Element Material: SILICON

Silicon transistors offer good thermal stability and performance, making them a popular choice in the industry.

Maximum Drain Current (ID): 4.4 A

This reinforces the device's capability to handle currents efficiently and effectively in real-world applications.

Maximum Drain-Source On Resistance: 1.5 ohm

Low on-resistance minimizes power loss during operation, thereby increasing the efficiency of the circuit.

Terminal Position: SINGLE

Single terminal position simplifies connection and minimizes potential errors during assembly.

Technical Specifications

Power Field Effect Transistors (FET) STB5NK52ZD-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

170 mJ

Minimum DS Breakdown Voltage:

520 V

Maximum Drain Current (Abs) (ID):

4.4 A

Maximum Drain Current (ID):

4.4 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

17.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB5NK52ZD-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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