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STB50NH02LT4

STMicroelectronics

STB50NH02LT4 by STMicroelectronics

STB50NH02LT4 from STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a max drain current of 50 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for high-performance power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,357 parts In-Stock

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2,357

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Anansix

USA . 2,145 parts In-Stock

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2,145

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Vyrian

USA . 1,197 parts In-Stock

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1,197

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,662 parts In-Stock

1+ parts

$1.302

100+ parts

-

1k+ parts

$1.172

10k+ parts

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1,662

$1.302

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$1.172

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MKK Technologies

India . 2,227 parts In-Stock

1+ parts

$2.448

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2,227

$2.448

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DigiPath Technology Company

USA . 2,227 parts In-Stock

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$2.448

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2,227

$2.448

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Corphita

USA . 2,492 parts In-Stock

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2,492

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Parana Technologies

USA . 2,359 parts In-Stock

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100+ parts

$1.556

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2,359

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$1.556

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Overview

Elevate your designs with the STB50NH02LT4 from STMicroelectronics, a leader in innovation and quality. This high-performance N-channel Power FET is engineered for efficient switching applications, boasting exceptional reliability and robustness. Its compact surface mount design maximizes space while delivering outstanding power management capabilities. Choose STMicroelectronics for cutting-edge technology that powers your projects to new heights, ensuring durability and performance you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durable protection and insulation, making the FET suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency in switching applications, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage, increasing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast response times and control capabilities.

Surface Mount: YES

Surface mount design enables compact PCB layouts and simplifies automated assembly processes.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24 V provides sufficient margin for various applications, ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and allows for efficient thermal management.

Terminal Form: GULL WING

Gull wing terminals make for secure soldering and better mechanical stability on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode offers higher efficiency in switching applications by requiring voltage to conduct, reducing standby power.

Maximum Pulsed Drain Current (IDM): 200 A

A high pulsed drain current capability allows for handling transient loads effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 200 mJ

The avalanche energy rating indicates robustness in high-energy scenarios, enhancing reliability in turbulent environments.

Maximum Drain Current (Abs) (ID): 50 A

A maximum drain current of 50 A provides ample capacity for most high-power applications, ensuring desired performance.

No. of Terminals: 2

With only two terminals, the device allows for straightforward integration into various circuit designs.

Maximum Power Dissipation (Abs): 60 W

High power dissipation rating allows the FET to handle considerable power loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirements, making it ideal for modern compact electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables better scalability and efficiency, particularly for digital and analog applications.

Maximum Operating Temperature: 175 °C

A high operating temperature rating guarantees reliability in extreme conditions, broadening application scope.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material providing reliable performance and established manufacturing processes.

Terminal Finish: TIN LEAD

Tin-lead finish ensures good solderability, critical for maintaining performance in manufacturing and repairs.

Maximum Drain Current (ID): 50 A

This specification confirms the capability to handle substantial current loads, ensuring effective operation in various applications.

Maximum Drain-Source On Resistance: 0.0135 ohm

Low on-resistance translates to higher efficiency and reduced heat generation during operation, enhancing overall device performance.

Terminal Position: SINGLE

Single terminal positioning simplifies PCB design and saves space without compromising functionality.

Case Connection: DRAIN

Having the case connected to the drain enhances thermal management and allows for effective heat dissipation.

Technical Specifications

Power Field Effect Transistors (FET) STB50NH02LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB50NH02LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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