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STB16NS25T4

STMicroelectronics

STB16NS25T4 by STMicroelectronics

STB16NS25T4 from STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a max drain current of 16 A, breakdown voltage of 250 V, and operates at up to 150 °C. Ideal for compact power management solutions.

Median Price

$1.498

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$1.498

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150

$1.498

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Digiode

USA . 4,643 parts In-Stock

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4,643

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Vyrian

USA . 3,101 parts In-Stock

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3,101

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Anansix

USA . 1,596 parts In-Stock

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1,596

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ComSIT Distribution GmbH

Germany . 515 parts In-Stock

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515

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ComSIT USA

USA . 515 parts In-Stock

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515

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,136 parts In-Stock

1+ parts

$0.986

100+ parts

-

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$0.888

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1,136

$0.986

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$0.888

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MKK Technologies

India . 56 parts In-Stock

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$1.855

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56

$1.855

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DigiPath Technology Company

USA . 56 parts In-Stock

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$1.855

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56

$1.855

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AZTECH Wire

Italy . 254 parts In-Stock

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$20.020

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254

$20.020

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Component Stockers USA

USA . 325 parts In-Stock

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$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,672 parts In-Stock

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Corphita

USA . 4,606 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,795 parts In-Stock

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3,795

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Parana Technologies

USA . 2,229 parts In-Stock

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$1.179

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$1.179

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Overview

Unlock the future of efficient power management with the STB16NS25T4 from STMicroelectronics! Renowned for innovation and reliability, STMicroelectronics delivers superior N-channel FETs designed for seamless switching applications. With robust performance in a compact package, this transistor ensures optimal energy efficiency and durability even in demanding environments. Elevate your projects today and experience unparalleled quality and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material providing reliable performance and ease of integration in a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their higher electron mobility, allowing for faster switching and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against reverse polarity, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, optimizing performance in power management scenarios.

Surface Mount: YES

Surface mount packaging allows for compact designs and is cost-effective for high-volume manufacturing.

Minimum DS Breakdown Voltage: 250 V

A high breakdown voltage makes this FET suitable for high-voltage applications, providing greater design flexibility.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of PCB space and easy alignment during assembly.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and ease of inspection.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode transistors are normally off, leading to lower power consumption until activated.

Maximum Pulsed Drain Current (IDM): 64 A

High pulsed drain current rating enables handling of transient loads, making it suitable for power surge applications.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating offers extra durability in applications where voltage spikes and transients are common.

Maximum Drain Current (Abs) (ID): 16 A

Allows for significant current handling, making it versatile for various power applications.

No. of Terminals: 2

A simple 2-terminal configuration simplifies circuit design and reduces the potential for connection issues.

Maximum Power Dissipation (Abs): 140 W

High power dissipation capability enables effective thermal management in power applications.

Package Style (Meter): SMALL OUTLINE

Compact small outline package is ideal for space-constrained PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances efficiency and scalability, suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

High operating temperature rating ensures reliable operation in harsh environments.

Transistor Element Material: SILICON

Silicon material offers good thermal conductivity and electrical performance, making it a standard choice for FETs.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and provides a good barrier against oxidation, ensuring reliable electrical connections.

Maximum Drain Current (ID): 16 A

Consistent with the maximum drain rating for both continuous and pulsed operation, providing flexibility in various applications.

Maximum Drain-Source On Resistance: 0.28 ohm

Low on-resistance minimizes power losses and improves overall efficiency in the circuit.

Terminal Position: SINGLE

Single terminal configuration reduces the complexity of layout and design, making it user-friendly.

Technical Specifications

Power Field Effect Transistors (FET) STB16NS25T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

64 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB16NS25T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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