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STA333SML

STMicroelectronics

STA333SML by STMicroelectronics

STA333SML by STMicroelectronics is a consumer IC with 30 terminals in a rectangular package. It operates b/w 0-70 °C, with Vsup ranging from 4.5-18V. The GRID ARRAY shape and 0.5mm terminal pitch make it suitable for various consumer circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,686 parts In-Stock

1+ parts

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4,686

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Vyrian

USA . 4,294 parts In-Stock

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4,294

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Anansix

USA . 509 parts In-Stock

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509

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 672 parts In-Stock

1+ parts

$3.001

100+ parts

-

1k+ parts

$2.701

10k+ parts

-

672

$3.001

-

$2.701

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Microchip USA

USA . 2,933 parts In-Stock

1+ parts

$3.968

100+ parts

-

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2,933

$3.968

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MKK Technologies

India . 2,103 parts In-Stock

1+ parts

$5.643

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2,103

$5.643

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DigiPath Technology Company

USA . 2,103 parts In-Stock

1+ parts

$5.643

100+ parts

-

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2,103

$5.643

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AZTECH Wire

Italy . 378 parts In-Stock

1+ parts

$11.000

100+ parts

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378

$11.000

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QUARKTWIN TECHNOLOGY LTD

USA . 22,979 parts In-Stock

1+ parts

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22,979

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Vigor

Singapore . 2,506 parts In-Stock

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2,506

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Parana Technologies

USA . 1,676 parts In-Stock

1+ parts

-

100+ parts

$3.588

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1,676

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$3.588

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Corphita

USA . 928 parts In-Stock

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928

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Overview

Unleash the power of innovation with the STA333SML by STMicroelectronics. Crafted with precision and expertise, this consumer IC offers unparalleled quality and reliability. From impressive sound systems to cutting-edge electronics, this versatile product is designed to elevate your creations to new heights. Experience seamless integration, superior performance, and endless possibilities with the STA333SML. Elevate your projects with the best in class.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and durability for the IC, making it suitable for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

No. of Terminals: 30

Having 30 terminals provides flexibility in connection options and potential functions of the IC.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can operate reliably in a wide range of environmental conditions.

Width: 2.57 mm

The compact width of 2.57mm allows for efficient use of PCB space, ideal for consumer electronics where size matters.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5V enables the IC to operate with low power consumption, suitable for portable devices.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this IC can handle higher voltage inputs when needed, providing versatility in applications.

Technical Specifications

Other Function Consumer ICs STA333SML attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B30

Length:

3.24 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.715 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.57 mm

Trade Compliance

STA333SML General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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