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ST92F124V1TB

STMicroelectronics

ST92F124V1TB by STMicroelectronics

ST92F124V1TB microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5 V with a max temp of 105 °C, and includes 77 I/O lines. Ideal for industrial applications, it supports I2C, SPI, and has integrated ADC channels. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,898 parts In-Stock

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Vyrian

USA . 3,505 parts In-Stock

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Anansix

USA . 2,821 parts In-Stock

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2,821

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Distributors (Availability)

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AZTECH Wire

Italy . 797 parts In-Stock

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$10.780

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797

$10.780

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Microchip USA

USA . 497 parts In-Stock

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$20.884

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497

$20.884

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IDEA Electronic Components Group

UK . 1,475 parts In-Stock

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$35.422

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$31.880

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$35.422

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$31.880

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MKK Technologies

India . 1,816 parts In-Stock

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$66.608

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$66.608

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$66.608

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$66.608

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Component Stockers USA

USA . 754 parts In-Stock

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$99.990

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754

$99.990

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Corphita

USA . 4,614 parts In-Stock

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Parana Technologies

USA . 2,061 parts In-Stock

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$42.352

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$42.352

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Vigor

Singapore . 1,368 parts In-Stock

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Overview

Unlock your project’s potential with the ST92F124V1TB microcontroller from STMicroelectronics, a leader in quality and innovation. Designed for robust performance in industrial applications, this versatile 16-bit powerhouse excels in efficiency, boasting low power consumption and comprehensive connectivity options. With superior reliability across extreme temperatures, it’s perfect for everything from automation to consumer electronics, delivering exceptional value and peace of mind for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY ensures durability and a lightweight design, which is ideal for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved performance in high-density circuit layouts.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage allows flexibility in power supply choices, making it compatible with a variety of systems.

Address Bus Width: 22

A wider address bus width supports larger memory capacities, enhancing overall data handling capabilities.

Package Shape: SQUARE

The square shape provides efficient use of board space and can facilitate easier assembly in compact devices.

Bit Size: 16

With a 16-bit architecture, it balances performance and power consumption, suitable for a wide range of applications.

Power Supplies (V): 5

Operating at standard 5V supplies aligns with common electronic components, ensuring availability and compatibility.

No. of Terminals: 100

A higher number of terminals allows for more features and connectivity options, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style is ideal for applications where space is constrained, ensuring low-profile integration into devices.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage supports a broader range of voltage inputs, accommodating fluctuations in power supply.

Maximum Operating Temperature: 105 °C

Withstanding high temperatures makes this microcontroller suitable for industrial environments where thermal conditions can be challenging.

CPU Family: ST9

Being part of the ST9 family provides a trusted foundation, known for reliability and performance in embedded applications.

Minimum Operating Temperature: -40 °C

The capability to function in extreme low temperatures ensures reliability in harsh environments, ideal for outdoor or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances corrosion resistance and improves the longevity and performance of the connections.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interact directly with analog signals, enhancing its versatility for various applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, enhancing the microcontroller's performance in data-intensive tasks.

Terminal Position: QUAD

The quad terminal position simplifies board layout and improves soldering efficiency, contributing to a reliable and compact design.

ROM Words: 131072

A high ROM size allows for extensive firmware and data storage, offering flexibility in software design.

Maximum Seated Height: 1.6 mm

The low seated height supports compact design requirements, which is essential in miniaturized electronic devices.

Width: 14 mm

The compact width allows for efficient space usage on PCBs, making it suitable for size-sensitive applications.

Data EEPROM Size: 1K

The 1K data EEPROM provides sufficient storage for critical application data, allowing for flexible data management options.

External Data Bus Width: 8

An 8-bit external data bus width enhances compatibility with standard peripherals, making integration easier.

Peripherals: DMA, TIMER(6)

The inclusion of multiple peripherals allows for robust control and management of various tasks, enhancing the microcontroller's functionality.

Maximum Clock Frequency: 5 MHz

A maximum clock frequency of 5 MHz strikes a balance between power consumption and performance, suitable for many applications.

Length: 14 mm

The compact length promotes space efficiency in hardware designs, crucial for modern electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures robust operation in environments with varying thermal conditions, enhancing reliability.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it integrates all necessary functionalities for control applications in a single chip.

RAM Bytes: 4096

A sizeable RAM capacity of 4096 bytes supports more complex applications and efficient operation of programs.

Technology: HCMOS

HCMOS technology leads to lower power consumption while maintaining fast signal processing capabilities, thus enhancing energy efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly, improving manufacturability.

Analog To Digital Convertors: 16-Ch 10-Bit

A 16-channel 10-bit ADC allows for versatile data acquisition from many sources, enhancing the microcontroller's application range.

Maximum Supply Current: 60 mA

A maximum supply current of 60 mA allows for efficient power management in battery-operated devices.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V aligns with the standard for many components, ensuring design compatibility.

PWM Channels: YES

Integrated PWM channels provide advanced control over outputs, useful for motor control and other precise applications.

Connectivity: I2C, LIN, SCI(2), SPI

Multiple connectivity options ensure seamless integration with other devices and sensors, enhancing interoperability.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware, providing flexibility in application development.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm supports higher-density designs, allowing for sophisticated layouts in compact systems.

Speed: 24 rpm

A rotational speed of 24 rpm is suitable for specific control applications, providing adequate performance in precise motion tasks.

On Chip Program ROM Width: 8

An 8-bit width for on-chip program ROM optimizes space and efficiency for application-specific tasks.

No. of I/O Lines: 77

With 77 I/O lines, this microcontroller provides extensive options for connecting various peripherals, enhancing its flexibility.

Technical Specifications

Microcontrollers ST92F124V1TB attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

CPU Family:

ST9

Maximum Clock Frequency:

5 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, LIN, SCI(2), SPI

Peripherals:

DMA, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST92F124V1TB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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