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ST75C176BN

STMicroelectronics

ST75C176BN by STMicroelectronics

ST75C176BN by STMicroelectronics is a BICMOS line transceiver with a max supply voltage of 5.25V and operates b/w -40 °C to 85°C. It features a max transmit delay of 60ns, supports EIA-422/EIA-485 standards, and is ideal for industrial communication applications. With an 8-terminal in-line package, it ensures reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,596 parts In-Stock

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10,596

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Digiode

USA . 3,294 parts In-Stock

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3,294

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Anansix

USA . 2,088 parts In-Stock

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2,088

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 500 parts In-Stock

1+ parts

$9.423

100+ parts

-

1k+ parts

$8.480

10k+ parts

-

500

$9.423

-

$8.480

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AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$16.530

100+ parts

-

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666

$16.530

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MKK Technologies

India . 1,292 parts In-Stock

1+ parts

$17.719

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1,292

$17.719

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DigiPath Technology Company

USA . 1,292 parts In-Stock

1+ parts

$17.719

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1,292

$17.719

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Microchip USA

USA . 7,626 parts In-Stock

1+ parts

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7,626

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QUARKTWIN TECHNOLOGY LTD

USA . 5,160 parts In-Stock

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Corphita

USA . 1,945 parts In-Stock

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1,945

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Parana Technologies

USA . 1,910 parts In-Stock

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$11.266

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1,910

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$11.266

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Vigor

Singapore . 1,081 parts In-Stock

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1,081

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Overview

Elevate your projects with the ST75C176BN from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile line driver and receiver offers exceptional performance for industrial applications, ensuring reliable data transmission even in challenging environments. With superior temperature resilience and low power consumption, you gain unmatched efficiency and durability. Trust in STMicroelectronics' quality to drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the product's robustness, making it suitable for various environments.

Maximum Supply Voltage: 5.25 V

This high maximum supply voltage allows for flexible integration into systems that operate within this range.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and allows for easy mounting in a variety of applications.

Maximum Transmit Delay: 60 ns

A low transmit delay ensures faster signal transmission, which is crucial for high-speed communication applications.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V simplifies circuit design and power management.

No. of Terminals: 8

The 8-terminal configuration allows for versatile connections, accommodating various circuit designs.

Package Style (Meter): IN-LINE

The in-line package style is straightforward and space-efficient for integration into tight layouts.

Maximum High Level Input Current: 0.001 Amp

Low input current minimizes power consumption and enhances the efficiency of the application.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage allows for operation in environments with varying power supply stability.

Maximum Operating Temperature: 85 °C

The high operating temperature range indicates suitability for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable performance in extreme environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB layout and simplifies routing strategies.

Maximum Seated Height: 4.8 mm

A low seated height is advantageous for applications requiring compact designs with minimal vertical space.

Width: 7.62 mm

The width aligns with standard packaging, making it compatible with existing designs and layouts.

Maximum Output Low Current: 4 Amp

High current output capability supports a wide range of applications, including those requiring significant load driving.

Differential Output: YES

Differential output minimizes noise and enhances data integrity over longer distances, which is essential for reliable communication.

Minimum Out Swing: 1.5 V

A minimum output swing of 1.5 V contributes to better signal quality, ensuring clear communication.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for durability and reliability in demanding environments, making it a solid choice for complex applications.

Maximum Receive Delay: 210 ns

An acceptable receive delay ensures that the product meets timing requirements for most applications, balancing performance and reliability.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS, resulting in high speed, low power consumption, and flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are suitable for prototyping and robust applications.

Interface Standard: EIA-422; EIA-485

Compatibility with established interface standards guarantees ease of integration into existing systems and ensures wide usability.

Maximum Supply Current: 0.9 mA

A low supply current ensures efficient operation, extending battery life in portable applications.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The use of a differential Schmitt trigger helps eliminate noise and provides a clean transition in input signals, improving reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V simplifies power supply design, ensuring compatibility with a wide range of power sources.

Terminal Pitch: 2.54 mm

A standard terminal pitch allows for seamless integration into circuit boards and simplifies layout design.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is optimized for transmitting and receiving signals over long distances, making it ideal for robust communication applications.

Technical Specifications

Line Drivers & Receivers ST75C176BN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

210 ns

Receiver No. of Bits:

1

Maximum Seated Height:

4.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

60 ns

Width:

7.62 mm

Trade Compliance

ST75C176BN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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