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ST75C176BD

STMicroelectronics

ST75C176BD by STMicroelectronics

ST75C176BD by STMicroelectronics is a BICMOS line transceiver with a max supply voltage of 5.25V and operates in extreme temps from -40 °C to 85°C. It features a max transmit delay of 60ns, making it ideal for EIA-422/EIA-485 applications. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,012 parts In-Stock

1+ parts

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100+ parts

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4,012

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Digiode

USA . 3,607 parts In-Stock

1+ parts

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1k+ parts

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3,607

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Anansix

USA . 684 parts In-Stock

1+ parts

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684

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,273 parts In-Stock

1+ parts

$10.977

100+ parts

-

1k+ parts

$9.879

10k+ parts

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2,273

$10.977

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$9.879

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MKK Technologies

India . 1,215 parts In-Stock

1+ parts

$20.641

100+ parts

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1,215

$20.641

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DigiPath Technology Company

USA . 1,215 parts In-Stock

1+ parts

$20.641

100+ parts

-

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10k+ parts

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1,215

$20.641

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-

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Parana Technologies

USA . 1,324 parts In-Stock

1+ parts

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100+ parts

$13.124

1k+ parts

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1,324

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$13.124

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Corphita

USA . 751 parts In-Stock

1+ parts

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751

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Overview

Elevate your designs with the ST75C176BD from STMicroelectronics, a standout in line drivers and receivers. Renowned for exceptional quality and reliability, STMicroelectronics ensures this device excels in diverse applications, from industrial automation to telecommunications. With its compact size and robust performance, the ST75C176BD delivers low power consumption and fast signal processing, empowering you to create efficient, high-speed solutions tailored to meet your needs. Experience the value and peace of mind that come from choosing a trusted industry leader!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, facilitating easy integration into modern electronics.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V ensures compatibility with standard logic levels, providing reliability in various applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and space-saving on circuit boards, providing flexibility for designers.

Maximum Transmit Delay: 60 ns

A low transmit delay enhances performance in communications, ensuring quick response times in data transmission.

Power Supplies (V): 5

Operating at 5V makes this device compatible with widely used digital systems, enhancing interoperability.

No. of Terminals: 8

With 8 terminals, this device offers sufficient connections while maintaining simplicity in design, ideal for compact applications.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space usage, which is beneficial for high-density applications.

Maximum High Level Input Current: 0.001 Amp

Low input current reduces power consumption, making the device efficient and suitable for battery-powered applications.

Minimum Supply Voltage: 4.75 V

The minimum voltage requirement ensures consistent performance across a variety of power supply conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, this high temperature tolerance ensures reliable operation in challenging environments.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this device robust for usage in extreme conditions and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish contributes to improved reliability and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning facilitates improved electrical performance and layout flexibility on circuit designs.

Maximum Seated Height: 1.75 mm

Low profile design allows for more compact layouts and better airflow in densely populated boards.

Width: 3.9 mm

A compact width aids in space-efficient board design, making it suitable for tight spaces.

Maximum Output Low Current: 4 Amp

High output current capability allows this component to drive significant loads, enhancing versatility in applications.

Differential Output: YES

Differential outputs improve noise immunity and signal integrity, crucial for long-distance transmissions.

Length: 4.9 mm

Short length contributes to compact design and facilitates easier placement within confined areas on the PCB.

Minimum Out Swing: 1.5 V

A minimum output swing ensures compatibility with standard logic levels, enhancing communication with other devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliable operation across a wide range of environmental conditions.

Maximum Receive Delay: 210 ns

Low receive delay facilitates efficient data handling, which is essential for high-speed communications.

Technology: BICMOS

BICMOS technology combines advantages of both bipolar and CMOS processes, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals enable easier soldering and better mechanical stability, improving manufacturing reliability.

Interface Standard: EIA-422; EIA-485

Compatibility with industry standards ensures this device can be used in a wide range of applications, enhancing utility.

Maximum Supply Current: 0.9 mA

Low supply current minimizes heat generation and power consumption, making this a cost-effective solution.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Schmitt trigger inputs provide improved noise immunity, resulting in reliable operation in electrically noisy environments.

Nominal Supply Voltage: 5 V

Nominal voltage of 5 V supports standard system designs, making this device versatile for various applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch aids in automatic assembly processes and compatibility with existing PCB designs.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for robust communication over long distances, ideal for industrial networks.

Technical Specifications

Line Drivers & Receivers ST75C176BD attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

210 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

60 ns

Width:

3.9 mm

Trade Compliance

ST75C176BD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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