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ST75C176CDR

STMicroelectronics

ST75C176CDR by STMicroelectronics

ST75C176CDR from STMicroelectronics is a BICMOS line transceiver with a max supply voltage of 5.25V and operates within -0 °C to 70°C. It features a max transmit delay of 60ns, making it ideal for high-speed data communication applications. With differential output and EIA-422/EIA-485 compatibility, it's perfect for robust signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,138 parts In-Stock

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8,138

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ComSIT Distribution GmbH

Germany . 4,950 parts In-Stock

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4,950

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ComSIT USA

USA . 4,950 parts In-Stock

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4,950

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Digiode

USA . 2,716 parts In-Stock

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2,716

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Anansix

USA . 2,173 parts In-Stock

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2,173

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Lantek

USA . 323 parts In-Stock

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323

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,431 parts In-Stock

1+ parts

$5.050

100+ parts

-

1k+ parts

$4.545

10k+ parts

-

1,431

$5.050

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$4.545

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Microchip USA

USA . 500 parts In-Stock

1+ parts

$6.519

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-

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500

$6.519

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MKK Technologies

India . 1,033 parts In-Stock

1+ parts

$9.496

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1,033

$9.496

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DigiPath Technology Company

USA . 1,033 parts In-Stock

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$9.496

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1,033

$9.496

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AZTECH Wire

Italy . 955 parts In-Stock

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$21.050

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955

$21.050

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Component Stockers USA

USA . 245 parts In-Stock

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$99.990

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245

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 13,148 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 5,408 parts In-Stock

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Corphita

USA . 4,380 parts In-Stock

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4,380

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Vigor

Singapore . 2,806 parts In-Stock

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2,806

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Parana Technologies

USA . 2,170 parts In-Stock

1+ parts

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$6.038

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2,170

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$6.038

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GreenTree Electronics

Israel . 323 parts In-Stock

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323

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Overview

Elevate your designs with the ST75C176CDR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust line driver and receiver delivers exceptional performance for demanding applications, ensuring reliable data transmission with minimal delay. Packaged in a compact design, it effortlessly integrates into various systems, enhancing connectivity while optimizing power efficiency. Experience unmatched quality and support, empowering your projects to succeed!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and protection against environmental factors, making this product reliable in various applications.

Surface Mount: YES

Being surface mount compatible allows for compact designs, easier integration into modern electronic circuits, and helps save PCB space.

Maximum Supply Voltage: 5.25 V

Supports a higher maximum supply voltage, allowing for flexibility in sourcing power and improved compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs and facilitates efficient layout design.

Maximum Transmit Delay: 60 ns

A low transmit delay enhances the speed of data transmission, making it suitable for high-speed applications.

Power Supplies (V): 5

Standard 5V power supply fits most digital circuits, ensuring compatibility and ease of use in various designs.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and functionalities, supporting a range of configuration options.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing a compact solution without sacrificing performance.

Maximum High Level Input Current: 0.001 Amp

Low high-level input current minimizes power consumption and reduces heat generation, enhancing overall efficiency.

Minimum Supply Voltage: 4.75 V

With a minimum supply voltage of 4.75 V, this product guarantees stable performance across a wide range of power supply variations.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows the device to function reliably in warm environments, making it suitable for various industrial applications.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable operation in cooler climates, broadening application potential.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes like nickel palladium gold enhance corrosion resistance and provide reliable electrical connectivity over time.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and offers versatility in design configurations.

Maximum Seated Height: 1.75 mm

A low seated height profile is beneficial for reduced overall product height, accommodating slimmer designs.

Width: 3.9 mm

A width of 3.9 mm allows for compact placements within tight spaces on PCBs.

Maximum Output Low Current: 4 Amp

A high maximum output low current rating supports robust signal transmission and drives higher loads effectively.

Differential Output: YES

Differential output improves noise immunity and signal integrity, making it ideal for long-distance transmission.

Length: 4.9 mm

Compact length facilitates easy integration into space-restricted designs without compromising on functionality.

Minimum Out Swing: 1.5 V

A minimum output swing of 1.5 V ensures robust signal levels are maintained for reliable communication.

Temperature Grade: COMMERCIAL

Commercial temperature grading makes it suitable for a wide variety of general-purpose applications without special handling.

Maximum Receive Delay: 210 ns

Reasonable receive delay supports high-speed data communications, making it suitable for diverse networked environments.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, ensuring reliable connections.

Interface Standard: EIA-422; EIA-485

Supports widely used interface standards, ensuring compatibility with a range of industrial communication systems.

Maximum Supply Current: 0.9 mA

A low maximum supply current contributes to energy efficiency, minimizing the overall power consumption of the device.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics enhance noise rejection and improve performance in electrically noisy environments.

Nominal Supply Voltage: 5 V

Operates at a nominal 5V supply standard, ensuring compatibility with most digital components.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard in many applications, providing ease of integration and compatibility with existing designs.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is ideal for long-distance data transmission, making it suitable for various communication applications.

Technical Specifications

Line Drivers & Receivers ST75C176CDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

210 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

60 ns

Width:

3.9 mm

Trade Compliance

ST75C176CDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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