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ST75185CN

STMicroelectronics

ST75185CN by STMicroelectronics

ST75185CN by STMicroelectronics is a Line Driver & Receiver with 3 functions, operating at 5.5V max supply voltage. It has a max transmit delay of 500ns and is ideal for EIA-232-E, TIA-232-E, V.28 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,732 parts In-Stock

1+ parts

-

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4,732

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Anansix

USA . 2,694 parts In-Stock

1+ parts

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10k+ parts

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2,694

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Digiode

USA . 936 parts In-Stock

1+ parts

-

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936

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ComSIT Distribution GmbH

Germany . 66 parts In-Stock

1+ parts

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66

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,227 parts In-Stock

1+ parts

$8.131

100+ parts

-

1k+ parts

$7.318

10k+ parts

-

2,227

$8.131

-

$7.318

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MKK Technologies

India . 1,506 parts In-Stock

1+ parts

$15.290

100+ parts

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10k+ parts

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1,506

$15.290

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DigiPath Technology Company

USA . 1,506 parts In-Stock

1+ parts

$15.290

100+ parts

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10k+ parts

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1,506

$15.290

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Corphita

USA . 2,207 parts In-Stock

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2,207

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Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

-

100+ parts

$9.722

1k+ parts

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10k+ parts

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1,135

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$9.722

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Overview

Experience seamless communication with the ST75185CN line driver and receiver by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, such as industrial automation and telecommunications, this product offers unparalleled value and performance. Stay connected with confidence and efficiency using the ST75185CN - your ultimate solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and heat resistance, making the product suitable for a variety of industrial applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, increasing its versatility.

No. of Functions: 3

Having multiple functions in a single device can save space and reduce the need for additional components, simplifying the overall circuit design.

Maximum Transmit Delay: 500 ns

A low transmit delay ensures fast data transmission, making this product ideal for applications that require real-time communication.

Power Supplies (V): 5,+-7.5/+-15

The multiple power supply options allow for flexible voltage configurations, catering to different system requirements.

Maximum High Level Input Current: 0.00001 Amp

This low input current helps in reducing power consumption and ensures efficient operation of the product.

Technology: BIPOLAR

Bipolar technology offers high noise immunity and precise signal processing, making the product reliable in noisy environments.

Interface Standard: EIA-232-E; TIA-232-E; V.28

Compliance with industry standards ensures compatibility with a wide range of devices and systems, enhancing usability.

Technical Specifications

Line Drivers & Receivers ST75185CN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Additional Features:

SUPPORT DATA RATESUPTO120 KBPS

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E; V.28

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

6 V

Maximum Output Low Current:

10 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,+-7.5/+-15

Qualification:

Not Qualified

Maximum Receive Delay:

1000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

3.93 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

7.5 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

500 ns

Width:

7.62 mm

Trade Compliance

ST75185CN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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