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ST75C185CDR

STMicroelectronics

ST75C185CDR by STMicroelectronics

ST75C185CDR by STMicroelectronics is a Line Driver & Receiver with 3 functions, operating at 5.5V max supply voltage. It features EIA-232-E interface standard, BICMOS technology, and Schmitt trigger input characteristics. Ideal for commercial applications requiring reliable data transmission over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,969 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,969

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Digiode

USA . 2,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,397

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Anansix

USA . 367 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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367

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Resion

USA . 5 parts In-Stock

1+ parts

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100+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,369 parts In-Stock

1+ parts

$6.201

100+ parts

-

1k+ parts

$5.581

10k+ parts

-

2,369

$6.201

-

$5.581

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MKK Technologies

India . 2,345 parts In-Stock

1+ parts

$11.660

100+ parts

-

1k+ parts

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10k+ parts

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2,345

$11.660

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DigiPath Technology Company

USA . 2,345 parts In-Stock

1+ parts

$11.660

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

$11.660

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-

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Corphita

USA . 4,938 parts In-Stock

1+ parts

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4,938

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Parana Technologies

USA . 923 parts In-Stock

1+ parts

-

100+ parts

$7.414

1k+ parts

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10k+ parts

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923

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$7.414

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Overview

Experience seamless communication with the ST75C185CDR by STMicroelectronics, a top-quality line driver & receiver designed to meet your connectivity needs. Manufactured by industry leader STMicroelectronics, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this compact device ensures efficient data transmission with its innovative features. With ST75C185CDR, customers can enjoy the value of superior technology, enhanced functionality, and peace of mind knowing they are investing in a trusted brand. Elevate your connectivity experience today with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of systems.

No. of Functions: 3

Having multiple functions in one device increases efficiency and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular packaging is easy to handle and fits well on PCB layouts.

Maximum Transmit Delay: 4000 ns

Low transmit delay ensures fast data transmission, essential for real-time applications.

Maximum Supply Voltage-1: 13.2 V

High supply voltage tolerance provides flexibility in power supply options.

Power Supplies: 5,+12

Support for dual power supplies (+5 V and ±12 V) enables versatile integration in various systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interface options.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and reduces overall footprint.

Minimum Supply Voltage-1: 7 V

The minimum supply voltage of 7 V ensures stable operation in lower power scenarios.

Maximum High Level Input Current: 0.000001 Amp

Low input current requirements make the product energy-efficient and suitable for low-power applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High operating temperature range of up to 70 °C ensures reliability in various environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for use in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good contact and longevity of the product.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connection options.

Maximum Seated Height: 2.65 mm

Low seated height makes the product suitable for compact designs and space-constrained applications.

Width: 7.5 mm

Compact width allows for efficient use of PCB space and easy integration into tight layouts.

Maximum Output Low Current: 3.2 Amp

High output low current capability allows for driving power-hungry devices and components.

Receiver No. of Bits: 5

5-bit receiver provides sufficient data resolution and accuracy for communication signals.

Length: 12.8 mm

Moderate length of 12.8 mm allows for easy installation and handling on the PCB.

Minimum Out Swing: 10 V

The minimum out swing of 10 V ensures compatibility with a wide range of interface standards.

Temperature Grade: COMMERCIAL

Commercial-grade temperature rating ensures reliability and performance in standard operating conditions.

Maximum Receive Delay: 4000 ns

Low receive delay ensures fast response time for receiving data, essential for real-time applications.

Technology: BICMOS

BICMOS technology offers a combination of bipolar and CMOS benefits, providing high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection to the PCB.

Interface Standard: EIA-232-E

Compliance with EIA-232-E interface standard ensures compatibility with a wide range of communication protocols.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics provide noise immunity and reliable signal processing.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V ensures stable operation and compatibility with common power sources.

Nominal Negative Supply Voltage: -12 V

Nominal negative supply voltage of -12 V supports dual power supply configurations and voltage levels.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm facilitates easy connections and compatibility with standard PCB layouts.

Nominal Supply Voltage-1: 12 V

Nominal supply voltage of 12 V supports various power supply configurations and voltage levels.

Driver No. of Bits: 3

3-bit driver provides sufficient data resolution and accuracy for transmitting signals.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type offers bidirectional data transmission and reception capabilities for versatile communication.

Technical Specifications

Line Drivers & Receivers ST75C185CDR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,+-12

Qualification:

Not Qualified

Maximum Receive Delay:

4000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

13.2 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

4000 ns

Width:

7.5 mm

Trade Compliance

ST75C185CDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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