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ST75C185CN

STMicroelectronics

ST75C185CN by STMicroelectronics

ST75C185CN by STMicroelectronics is a Line Driver & Receiver with 3 functions, operating at -40 to 85 °C. It has a max supply voltage of 5.5V and can handle up to 13.2V. Ideal for EIA-232-E interface standard applications due to its BICMOS technology and Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,309 parts In-Stock

1+ parts

-

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3,309

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Anansix

USA . 1,503 parts In-Stock

1+ parts

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1k+ parts

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1,503

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Vyrian

USA . 604 parts In-Stock

1+ parts

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604

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DF Sales Co.

USA . 160 parts In-Stock

1+ parts

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160

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DF Sales Co.

USA . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 770 parts In-Stock

1+ parts

$11.288

100+ parts

-

1k+ parts

$10.160

10k+ parts

-

770

$11.288

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$10.160

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MKK Technologies

India . 1,429 parts In-Stock

1+ parts

$21.227

100+ parts

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1,429

$21.227

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DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$21.227

100+ parts

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10k+ parts

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1,429

$21.227

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Kepictronics

USA . 4,350 parts In-Stock

1+ parts

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4,350

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Corphita

USA . 1,489 parts In-Stock

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1,489

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Parana Technologies

USA . 855 parts In-Stock

1+ parts

-

100+ parts

$13.497

1k+ parts

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10k+ parts

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855

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$13.497

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Overview

Enhance your electronic designs with the ST75C185CN by STMicroelectronics, a top-quality line driver & receiver that offers unparalleled performance and reliability. Manufactured by industry leader STMicroelectronics, this product guarantees exceptional value and benefits to customers seeking seamless communication solutions. With its advanced technology and versatile applications, the ST75C185CN is the perfect choice for those looking to elevate their projects to the next level. Trust STMicroelectronics to deliver cutting-edge components that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of systems and devices.

No. of Functions: 3

Having multiple functions in one package reduces the need for additional components, making the product more cost-effective and compact.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and mounting in standard electronic configurations.

Maximum Transmit Delay: 4000 ns

This low delay ensures fast and reliable data transmission, making the product suitable for real-time applications.

Maximum High Level Input Current: 0.000001 Amp

The low input current requirement helps reduce power consumption and heat generation in the system.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures the product can function reliably in various environments without overheating.

Technology: BICMOS

BICMOS technology offers the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Interface Standard: EIA-232-E

Compliance with the EIA-232-E standard ensures compatibility with a wide range of communication systems and devices.

Technical Specifications

Line Drivers & Receivers ST75C185CN attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,+-12

Qualification:

Not Qualified

Maximum Receive Delay:

4000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

3.93 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

13.2 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

4000 ns

Width:

7.62 mm

Trade Compliance

ST75C185CN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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